Qualcomm incorporated (20240321497). INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE simplified abstract
Contents
INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE
Organization Name
Inventor(s)
Hsiao-Tsung Yen of San Diego CA (US)
Xingyi Hua of San Diego CA (US)
Jeongil Jay Kim of San Diego CA (US)
INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321497 titled 'INTEGRATED DEVICE COMPRISING A PAIR OF INDUCTORS WITH LOW OR NO MUTUAL INDUCTANCE
The abstract describes an integrated device with a die substrate and a die interconnection portion. The die interconnection includes a first inductor and a second inductor, each comprising a spiral with an origin and a tail.
- The integrated device includes a die substrate and a die interconnection portion.
- The die interconnection portion consists of a first inductor and a second inductor.
- Each inductor is made up of a spiral structure with an origin and a tail.
Potential Applications:
- This technology could be used in electronic devices such as smartphones, tablets, and computers.
- It may find applications in wireless communication systems and IoT devices.
Problems Solved:
- Provides a compact and efficient way to interconnect components in electronic devices.
- Offers a solution for integrating inductors into small form factor devices.
Benefits:
- Improved performance and efficiency in electronic devices.
- Space-saving design for compact devices.
- Enhanced connectivity and signal transmission.
Commercial Applications:
- This technology could be valuable for electronics manufacturers looking to enhance the performance and design of their products.
- It may have implications for the telecommunications industry and IoT device manufacturers.
Questions about the technology: 1. How does the spiral structure of the inductors contribute to the efficiency of the device? 2. What are the potential challenges in implementing this technology in mass-produced electronic devices?
Original Abstract Submitted
an integrated device comprising a die substrate; and a die interconnection portion coupled to the die substrate. the die interconnection comprises a first inductor and a second inductor. the first inductor comprises a first spiral comprising a first origin and a first tail and a second spiral comprising a second origin and a second tail.
