Qualcomm incorporated (20240319127). MOISTURE SENSOR HAVING INTEGRATED HEATING ELEMENT simplified abstract
Contents
MOISTURE SENSOR HAVING INTEGRATED HEATING ELEMENT
Organization Name
Inventor(s)
Abhijeet Paul of Escondido CA (US)
Mishel Matloubian of San Diego CA (US)
MOISTURE SENSOR HAVING INTEGRATED HEATING ELEMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319127 titled 'MOISTURE SENSOR HAVING INTEGRATED HEATING ELEMENT
The patent application describes a device with multiple layers forming capacitors, including a moisture-sensitive dielectric layer that can be dried using a heating element.
- First patterned metal layer
- First dielectric layer
- Second patterned metal layer
- Formation of a first capacitor
- Second moisture-sensitive dielectric layer
- Third patterned metal layer
- Formation of a second moisture-sensitive capacitor
- Heating element in the first patterned metal layer
- Moisture removal from the second capacitor
- Response to electrical power provision
Potential Applications: - Electronic devices - Moisture-sensitive environments - Capacitor technology
Problems Solved: - Moisture damage in electronic components - Efficient moisture removal techniques
Benefits: - Improved reliability of electronic devices - Enhanced performance in humid conditions
Commercial Applications: - Consumer electronics - Industrial equipment - Moisture-sensitive sensors
Questions about the Technology: 1. How does the heating element in the first patterned metal layer assist in removing moisture from the second capacitor? 2. What are the potential long-term benefits of using this moisture-sensitive capacitor technology?
Frequently Updated Research: - Ongoing advancements in capacitor technology - New methods for moisture removal in electronic components
Overall, the patent application introduces a novel approach to addressing moisture sensitivity in capacitors, offering potential benefits for various electronic applications.
Original Abstract Submitted
in an aspect, a device includes: a first patterned metal layer; a first dielectric layer disposed over the first patterned metal layer; a second patterned metal layer disposed over the first dielectric layer, wherein the first patterned metal layer, the first dielectric layer, and the second patterned metal layer form a first capacitor; a second moisture-sensitive dielectric layer disposed over the second patterned metal layer; and a third patterned metal layer disposed over the second moisture-sensitive dielectric layer, wherein the third patterned metal layer, the second moisture-sensitive dielectric layer, and the second patterned metal layer form a second capacitor that is moisture-sensitive, and the first patterned metal layer is further configured as a heating element to assist in removing moisture from the second moisture-sensitive dielectric layer of the second capacitor in response to provision of an electrical power to the first patterned metal layer.
