Samsung electronics co., ltd. (20240324243). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hyunchul Shin of Suwon-si (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240324243 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application consists of multiple data storage patterns on a substrate, spaced apart from each other in a parallel direction to the substrate's upper surface.
- The device includes a first upper conductive line connected to the data storage patterns and extending in the same direction, as well as a second upper conductive line on top of the first one.
- A series of via contacts are positioned between the first and second upper conductive lines, also aligned in the same direction but offset from the data storage patterns.
- The arrangement of the via contacts and conductive lines allows for efficient data storage and retrieval within the semiconductor device.
Potential Applications: - This technology could be used in memory storage devices such as flash drives or solid-state drives. - It may also find applications in microprocessors and other integrated circuits where data storage and processing are crucial.
Problems Solved: - The design of this semiconductor device addresses the challenge of efficiently storing and accessing data in a compact space. - By optimizing the layout of the data storage patterns and conductive lines, the device can enhance data transfer speeds and overall performance.
Benefits: - Improved data storage efficiency and speed. - Enhanced performance of semiconductor devices. - Potential for smaller and more powerful electronic devices.
Commercial Applications: Title: Advanced Semiconductor Device for High-Speed Data Storage This technology could revolutionize the memory storage industry by providing faster and more efficient data storage solutions for various electronic devices. The market implications include increased demand for high-performance memory storage components in consumer electronics, data centers, and other technological applications.
Questions about the technology: 1. How does the offset arrangement of via contacts improve data storage efficiency in the semiconductor device? 2. What are the potential limitations or challenges associated with implementing this technology in commercial products?
Original Abstract Submitted
a semiconductor device includes a plurality of data storage patterns on a substrate, the plurality of data storage patterns spaced apart from each other in a first direction parallel to an upper surface of the substrate, a first upper conductive line on the plurality of data storage patterns, extending in the first direction and connected to the plurality of data storage patterns, a second upper conductive line on the first upper conductive line and extending in the first direction and a plurality of via contacts between the first upper conductive line and the second upper conductive line and spaced apart from each other in the first direction. the plurality of via contacts are arranged to be offset from the plurality of data storage patterns in the first direction.
