Samsung electronics co., ltd. (20240324185). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240324185 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The present disclosure introduces semiconductor devices with a bit line. In some embodiments, a semiconductor device comprises a substrate with active regions defined by device isolation layers, multiple bit lines extending horizontally on the substrate, a bit line contact connecting a bit line to an active region, and an active pad on an adjacent active region.
- The semiconductor device includes a substrate with active regions and device isolation layers.
- Multiple bit lines extend horizontally on the substrate.
- A bit line contact connects a bit line to an active region.
- An active pad is located on an adjacent active region.
- The bit line contact consists of a first contact layer and a second contact layer.
- The active pad faces the bit line contact.
Potential Applications: - Memory devices - Integrated circuits - Microprocessors
Problems Solved: - Efficient data transfer between active regions and bit lines - Enhanced performance of semiconductor devices
Benefits: - Improved data processing speed - Higher efficiency in data storage and retrieval
Commercial Applications: Title: "Enhanced Semiconductor Devices for Faster Data Processing" This technology can be utilized in various commercial applications such as memory chips, microprocessors, and other electronic devices requiring fast data transfer and storage capabilities.
Questions about the technology: 1. How does the active pad contribute to the efficiency of data transfer in semiconductor devices? 2. What are the advantages of using multiple bit lines in this semiconductor device design?
Original Abstract Submitted
the present disclosure provides semiconductor devices including a bit line. in some embodiments, a semiconductor device includes a substrate including a plurality of active regions defined by device isolation layers, a plurality of bit lines extending in a first horizontal direction on the substrate, a bit line contact between a first active region of the plurality of active regions and a first bit line of the plurality of bit lines on the first active region, and an active pad on a second active region of the plurality of active regions adjacent to the first active region. the bit line contact includes a first contact layer and a second contact layer on the first contact layer. the active pad is disposed to face the bit line contact.
