Samsung electronics co., ltd. (20240322068). MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CHIP TRANSFER DEVICE simplified abstract

MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CHIP TRANSFER DEVICE

Organization Name

samsung electronics co., ltd.

Inventor(s)

Youngtek Oh of Suwon-si (KR)

Dongho Kim of Suwon-si (KR)

Joonyong Park of Suwon-si (KR)

Junsik Hwang of Suwon-si (KR)

Dongkyun Kim of Suwon-si (KR)

Sanghoon Song of Suwon-si (KR)

Minchul Yu of Suwon-si (KR)

Kyungwook Hwang of Suwon-si (KR)

MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CHIP TRANSFER DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240322068 titled 'MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CHIP TRANSFER DEVICE

The abstract describes a method for transferring micro semiconductor chips using a transfer substrate with grooves, a suspension, and an alignment bar with a hydrophobic wiper.

• Transfer method for micro semiconductor chips
• Transfer substrate with grooves for alignment
• Suspension containing chips and liquid
• Alignment bar with hydrophobic wiper for chip alignment
• Efficient and precise transfer process

Potential Applications: - Semiconductor manufacturing - Electronics industry - Research and development in microchip technology

Problems Solved: - Precision alignment of micro semiconductor chips - Efficient transfer process - Minimizing damage to chips during transfer

Benefits: - Improved accuracy in chip alignment - Streamlined transfer process - Reduced risk of chip damage

Commercial Applications: Title: "Advanced Microchip Transfer Method for Semiconductor Industry" This technology can be used in semiconductor manufacturing plants, electronics assembly lines, and research facilities working on microchip development. The method offers a more efficient and accurate way to transfer micro semiconductor chips, leading to cost savings and improved productivity in the industry.

Prior Art: Readers can explore prior research on microchip transfer methods, semiconductor manufacturing processes, and alignment techniques in the field of microelectronics.

Frequently Updated Research: Stay updated on advancements in microchip transfer technologies, semiconductor industry trends, and innovations in microchip manufacturing processes.

Questions about Micro Semiconductor Chip Transfer Method: 1. How does the alignment bar with a hydrophobic wiper contribute to the chip transfer process? 2. What are the key advantages of using a transfer substrate with grooves for aligning micro semiconductor chips?

Original Abstract Submitted

a micro semiconductor chip transfer method is provided and includes: preparing a transfer substrate including an upper portion having grooves formed therein; supplying, to the upper portion of the transfer substrate, a suspension including micro semiconductor chips and a liquid; and aligning the micro semiconductor chips in the grooves by sweeping, with an alignment bar that includes a hydrophobic wiper, an upper surface of the transfer substrate while the suspension is on the upper surface of the transfer substrate.