Samsung electronics co., ltd. (20240321842). PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract
Contents
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Organization Name
Inventor(s)
Byeong-Yeon Cho of Suwon-si (KR)
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321842 titled 'PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME
Simplified Explanation:
The patent application describes a package-on-package (PoP) semiconductor package consisting of an upper package and a lower package. The lower package contains a first semiconductor device in one area, a second semiconductor device in another area, and various vertical interconnections for data transfer and memory management.
- The patent application pertains to a package-on-package (PoP) semiconductor package design.
- The PoP package includes an upper package and a lower package.
- The lower package houses two semiconductor devices in different areas.
- The lower package features vertical interconnections for command-and-address, data input-output, and memory management.
- The design aims to improve data transfer and memory management within the semiconductor package.
Potential Applications:
The technology described in the patent application could be applied in:
- Mobile devices
- Wearable technology
- Internet of Things (IoT) devices
- Automotive electronics
- Industrial automation systems
Problems Solved:
The technology addresses the following issues:
- Efficient data transfer between semiconductor devices
- Improved memory management within the package
- Enhanced performance of electronic devices
Benefits:
The benefits of this technology include:
- Faster data transfer speeds
- Optimal memory utilization
- Enhanced overall performance of electronic devices
Commercial Applications:
The technology could be utilized in various commercial applications such as:
- Smartphones and tablets
- Smartwatches and fitness trackers
- Automotive infotainment systems
- Industrial control systems
- Consumer electronics
Questions about PoP Technology:
1. What are the key advantages of using a package-on-package (PoP) semiconductor package design?
- The PoP design allows for compact and efficient stacking of semiconductor devices, enabling higher performance and improved data transfer speeds.
2. How does the vertical interconnection system in the lower package enhance memory management?
- The vertical interconnections facilitate quick and efficient communication between the semiconductor devices, optimizing memory usage and overall system performance.
Original Abstract Submitted
a package-on-package (pop) semiconductor package includes an upper package and a lower package. the lower package includes a first semiconductor device in a first area, a second semiconductor device in a second area, and a command-and-address vertical interconnection, a data input-output vertical interconnection, and a memory management vertical interconnection adjacent to the first area.
