Samsung electronics co., ltd. (20240321788). PAD AND PACKAGE INCLUDING SAME simplified abstract
Contents
PAD AND PACKAGE INCLUDING SAME
Organization Name
Inventor(s)
Wenjun Wang of Suzhou Industrial Park (CN)
PAD AND PACKAGE INCLUDING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321788 titled 'PAD AND PACKAGE INCLUDING SAME
The abstract of the patent application describes a pad with a terminal portion having two surfaces and a curved concave portion that can clad a connecting conductor.
- Simplified Explanation:
- The pad has two surfaces and a curved concave portion that can cover a connecting conductor.
- Key Features and Innovation:
- Terminal portion with two surfaces. - Curved concave portion for cladding a connecting conductor.
- Potential Applications:
- Electrical connections in electronic devices. - Circuit board manufacturing.
- Problems Solved:
- Protecting and securing connecting conductors. - Ensuring proper electrical connections.
- Benefits:
- Improved durability of connections. - Enhanced electrical conductivity.
- Commercial Applications:
- Electronic manufacturing industry. - Consumer electronics market.
- Questions about the Technology:
1. How does the curved concave portion enhance the connection of the conductor? 2. What materials are typically used in the manufacturing of these pads?
- Frequently Updated Research:
- Ongoing studies on the efficiency of the pad in various electronic devices.
Original Abstract Submitted
a pad includes a terminal portion having a first surface and a second surface opposite to the first surface; and a curved concave portion formed in one of the first surface and the second surface, wherein the curved concave portion is configured to clad a portion of a connecting conductor.
