Samsung electronics co., ltd. (20240321776). SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE simplified abstract
Contents
SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE
Organization Name
Inventor(s)
Eunkyoung Choi of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321776 titled 'SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE
The semiconductor package described in the patent application consists of a package base substrate, an interposer, multiple semiconductor chips, and a stiffener structure with a stiffener frame and extension portion.
- The stiffener frame is located on the package base substrate, separate from the interposer, while the extension portion extends from the frame onto the interposer.
- The extension portion is spaced apart from the semiconductor chips and has a portion on the interposer, forming an integral structure with the stiffener frame.
Potential Applications: - This semiconductor package design could be used in various electronic devices such as smartphones, laptops, and tablets. - It can also be applied in automotive electronics, industrial machinery, and communication equipment.
Problems Solved: - Provides structural support and stability to the semiconductor chips during operation. - Helps in dissipating heat generated by the chips, improving overall performance and reliability.
Benefits: - Enhances the durability and longevity of the semiconductor package. - Improves thermal management, reducing the risk of overheating and potential damage to the chips.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers, electronics companies, and other industries requiring high-performance chip packaging solutions.
Questions about the technology: 1. How does the stiffener structure impact the overall reliability of the semiconductor package? 2. What are the specific advantages of having the stiffener frame separate from the interposer in this design?
Frequently Updated Research: - Stay updated on advancements in semiconductor packaging technologies, materials, and manufacturing processes to enhance the performance and efficiency of the semiconductor package.
Original Abstract Submitted
a semiconductor package including a package base substrate, an interposer on the package base substrate, a plurality of semiconductor chips on the interposer, and a stiffener structure including a stiffener frame and a stiffener extension portion, the stiffener frame being on the package base substrate and apart from the interposer, the stiffener extension portion extending from the stiffener frame, spaced apart from the plurality of semiconductor chips, and extending onto the interposer to have a portion on the interposer, and the stiffener frame being an integral structure with the extension portion, may be provided.
