Samsung electronics co., ltd. (20240321766). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME simplified abstract
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321766 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
The semiconductor chip described in the patent application consists of a substrate, an active layer on the substrate, and a coated layer surrounding the active layer on the side surfaces. The average roughness of the side surfaces of the active layer is higher than that of the upper surface, and the substrate makes contact with the coated layer.
- The semiconductor chip includes a substrate, an active layer, and a coated layer.
- The coated layer surrounds the active layer on the side surfaces.
- The average roughness of the side surfaces is greater than that of the upper surface.
- The substrate contacts the coated layer.
- This design aims to improve the performance and functionality of the semiconductor chip.
Potential Applications: - This technology can be used in the manufacturing of advanced electronic devices. - It may find applications in the development of high-performance computing systems. - The semiconductor chip could be utilized in the aerospace industry for space exploration missions.
Problems Solved: - Enhances the overall efficiency and reliability of semiconductor chips. - Improves the thermal management of electronic devices. - Provides better integration capabilities for complex circuitry.
Benefits: - Increased performance and functionality of electronic devices. - Enhanced thermal dissipation properties. - Improved durability and longevity of semiconductor chips.
Commercial Applications: Title: Advanced Semiconductor Chip Technology for Enhanced Performance This technology can be commercialized in the production of consumer electronics, data centers, and telecommunications equipment. It has the potential to revolutionize the semiconductor industry by offering more efficient and reliable solutions for various electronic applications.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching advancements in semiconductor manufacturing processes, materials science, and microelectronics design.
Frequently Updated Research: Researchers are continually exploring new materials and techniques to further enhance the performance and capabilities of semiconductor chips. Stay updated on the latest developments in semiconductor technology to leverage the full potential of this innovation.
Questions about Semiconductor Chip Technology: 1. How does the roughness of the side surfaces impact the overall performance of the semiconductor chip? 2. What are the specific advantages of the coated layer surrounding the active layer in terms of functionality and reliability?
Original Abstract Submitted
provided is a semiconductor chip including a substrate, an active layer on the substrate, and a coated layer on side surfaces of the active layer and configured to surround the active layer, wherein an average roughness of the side surfaces of the active layer is greater than an average roughness of an upper surface of the active layer, and at least a portion of the substrate contacts the coated layer.
