Samsung electronics co., ltd. (20240321722). SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
YOONYOUNG Jeon of SUWON-SI (KR)
SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321722 titled 'SEMICONDUCTOR PACKAGE, AND REDISTRIBUTION SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
The semiconductor package described in the abstract includes a semiconductor chip and a redistribution structure connected to the chip. The redistribution structure consists of an under bump pattern, a first redistribution layer with a first redistribution pad, a partition with a different material than the pad, a contact via, and a second redistribution layer with a second redistribution pad.
- Under bump pattern
- First redistribution layer with first redistribution pad
- Partition with different material
- Contact via
- Second redistribution layer with second redistribution pad
Potential Applications: - Advanced semiconductor packaging technology - Microelectronics industry - Integrated circuit manufacturing
Problems Solved: - Enhancing connectivity in semiconductor packages - Improving signal transmission efficiency - Increasing the density of interconnections
Benefits: - Higher performance in semiconductor devices - Enhanced reliability and durability - Cost-effective manufacturing process
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Improved Connectivity This technology can be utilized in various commercial applications such as: - Mobile devices - Computer systems - Automotive electronics
Questions about Semiconductor Package Technology: 1. How does the partition with a different material in the redistribution structure contribute to the overall performance of the semiconductor package? 2. What are the specific advantages of using a contact via in the redistribution structure of the semiconductor package?
Original Abstract Submitted
a semiconductor package includes a semiconductor chip, and a redistribution structure connected to the semiconductor chip. the redistribution structure may include an under bump pattern, a first redistribution layer disposed on the under bump pattern and including a first redistribution pad, a partition disposed inside the first redistribution pad and including a material that is different from that of the first redistribution pad, a contact via disposed on the first redistribution pad and the partition, and a second redistribution layer including a second redistribution pad disposed on the contact via.
