Samsung electronics co., ltd. (20240321701). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Hwanpil Park of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321701 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a package substrate, an interposer, a semiconductor chip, conductive connectors, and a capacitor stack structure.
- The package substrate, interposer, and semiconductor chip are key components of the semiconductor package.
- The conductive connectors facilitate the connection between the package substrate and the interposer.
- The capacitor stack structure includes a first capacitor connected to the package substrate and a second capacitor connected to the interposer.
Potential Applications:
- This technology can be applied in various electronic devices requiring efficient semiconductor packaging.
- It can be used in consumer electronics, telecommunications equipment, and automotive electronics.
Problems Solved:
- Provides a compact and efficient way to package semiconductor chips.
- Ensures reliable connections between different components of the semiconductor package.
Benefits:
- Improved performance and reliability of electronic devices.
- Enhanced thermal management due to the efficient packaging design.
Commercial Applications:
- This technology can be utilized by semiconductor manufacturers to enhance the performance of their electronic products.
- It can also benefit companies producing consumer electronics by improving the reliability of their devices.
Questions about the technology: 1. How does the capacitor stack structure contribute to the overall performance of the semiconductor package? 2. What are the specific advantages of using conductive connectors in this semiconductor packaging design?
Original Abstract Submitted
a semiconductor package includes a package substrate, an interposer, a semiconductor chip between the package substrate and the interposer, a plurality of conductive connectors between the package substrate and the interposer, and a capacitor stack structure between the package substrate and the interposer, the capacitor stack structure including a first capacitor connected to the package substrate, and a second capacitor connected to the interposer.
