Samsung electronics co., ltd. (20240321683). SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF simplified abstract
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SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF
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SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321683 titled 'SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF
Simplified Explanation: The semiconductor package described in the patent application consists of a semiconductor chip with a dummy semiconductor chip on top, connected by a bonding insulating layer. The dummy chip includes a cooling channel for fluid flow, and the bonding insulating layer has a concave-convex shape on its top surface.
- The semiconductor package includes a semiconductor chip and a dummy semiconductor chip connected by a bonding insulating layer.
- The dummy semiconductor chip features a cooling channel that allows cooling fluid to flow in from an inlet and out from an outlet.
- The bonding insulating layer has a concave-convex shape on its top surface.
Potential Applications: 1. Advanced cooling systems for semiconductor devices. 2. Improved thermal management in electronic components. 3. Enhanced performance and longevity of semiconductor chips.
Problems Solved: 1. Overheating issues in semiconductor devices. 2. Inefficient cooling mechanisms in electronic systems.
Benefits: 1. Increased reliability and efficiency of semiconductor packages. 2. Extended lifespan of electronic components. 3. Enhanced overall performance of electronic devices.
Commercial Applications: Advanced Thermal Management Solutions for Electronic Devices: Enhancing the cooling efficiency of semiconductor packages can lead to improved performance and reliability in various electronic applications, including computers, smartphones, and automotive electronics.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of semiconductor packaging, thermal management, and cooling systems for electronic devices.
Frequently Updated Research: Researchers are continually exploring new materials and designs to enhance the thermal performance of semiconductor packages and improve the overall efficiency of electronic devices.
Questions about Semiconductor Package Cooling Technology: 1. How does the concave-convex shape of the bonding insulating layer contribute to the cooling efficiency of the semiconductor package? 2. What are the potential challenges in implementing this advanced cooling system in mass-produced electronic devices?
Original Abstract Submitted
a semiconductor package may include a semiconductor chip, a dummy semiconductor chip on the semiconductor chip;, and a bonding insulating layer between the semiconductor chip and the dummy semiconductor chip. the bonding insulating layer may attach the semiconductor chip to the dummy semiconductor chip. the dummy semiconductor chip may include a cooling channel extending from an inlet to an outlet. the inlet may be in fluid communication with the outlet through the cooling channel. the inlet may be configured to allow a cooling fluid to flow in. the outlet may be configured to allow the cooling fluid to flow out. a top surface of the bonding insulating layer may have a concave-convex shape.
