Samsung electronics co., ltd. (20240321681). HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
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HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321681 titled 'HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation: The semiconductor package described in the patent application includes a substrate, a first semiconductor device, and a heat dissipation structure with a heat dissipation chamber containing a working fluid.
Key Features and Innovation:
- Heat dissipation structure with a heat dissipation chamber and isolation walls.
- Internal space for a working fluid to move.
- Vapor channels for heat dissipation.
- Overlapping arrangement of isolation walls and semiconductor device.
- Lateral extension of vapor channels from the center channel.
Potential Applications: This technology could be used in electronic devices, power systems, and other applications requiring efficient heat dissipation.
Problems Solved: This technology addresses the issue of heat buildup in semiconductor devices, which can affect performance and longevity.
Benefits:
- Improved heat dissipation efficiency.
- Enhanced performance and reliability of semiconductor devices.
- Potential for smaller and more compact electronic devices.
Commercial Applications: The technology could be valuable in the development of high-performance electronics, data centers, and industrial equipment where heat management is crucial for optimal operation.
Prior Art: Readers interested in prior art related to this technology could explore patents and research papers on semiconductor packaging, heat dissipation structures, and vapor chamber cooling systems.
Frequently Updated Research: Researchers are continually exploring new materials and designs to improve heat dissipation in semiconductor devices, which could lead to advancements in this field.
Questions about Semiconductor Package Technology: 1. What are the key components of a semiconductor package? 2. How does the heat dissipation structure in this technology improve performance?
Original Abstract Submitted
provided is a semiconductor package including a substrate, a first semiconductor device on the substrate, and a heat dissipation structure on the first semiconductor device including a heat dissipation chamber configured to provide an internal space in which a working fluid moves, and a plurality of first isolation walls arranged in the heat dissipation chamber to define a first center channel and a plurality of first vapor channels communicating with each other via the first center channel, wherein each of the plurality of first isolation walls vertically overlaps the first semiconductor device, the first center channel vertically overlaps the first semiconductor device, and each of the plurality of first vapor channels extends from the first center channel in a lateral direction.
