Samsung electronics co., ltd. (20240321679). HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
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HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Youngjoon Koh of Suwon-si (KR)
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321679 titled 'HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The patent application describes a heat dissipation structure with a heat dissipation chamber and a wick structure to guide a working fluid in a liquid state, with the chamber changing shape based on temperature.
- The heat dissipation structure includes a heat dissipation chamber with a lower wall, upper wall, and sidewalls for a working fluid to flow.
- A wick structure on the inner surface of the chamber guides the working fluid in a liquid state.
- The chamber can change its shape according to temperature variations.
Potential Applications: - Cooling systems for electronic devices - Thermal management in automotive applications - Heat exchangers in industrial processes
Problems Solved: - Efficient heat dissipation - Temperature regulation in confined spaces
Benefits: - Improved cooling performance - Energy efficiency - Extended lifespan of electronic components
Commercial Applications: Title: Advanced Heat Dissipation Solutions for Electronics This technology can be utilized in consumer electronics, automotive systems, and industrial machinery for enhanced thermal management, leading to improved performance and reliability.
Questions about the technology: 1. How does the wick structure enhance the heat dissipation process? The wick structure guides the working fluid in a liquid state, ensuring efficient heat transfer within the chamber. 2. What are the key advantages of a heat dissipation structure that can change its shape based on temperature? The ability to adapt to temperature changes allows for dynamic heat dissipation, optimizing cooling performance in various conditions.
Original Abstract Submitted
a heat dissipation structure may include a heat dissipation chamber including a lower wall, an upper wall on the lower wall, and a plurality of sidewalls extending between the lower wall and the upper wall, the heat dissipation chamber providing an inner space for a working fluid to flow therein; and a wick structure on an inner surface of the heat dissipation chamber. the wick structure may be configured to guide the working fluid in a liquid state. the heat dissipation chamber may be configured to change its shape according to a temperature.
