Samsung electronics co., ltd. (20240321667). SEMICONDUCTOR PACKAGE simplified abstract
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Seunghun Shin of Suwon-si (KR)
Unbyoung Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321667 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract consists of a first semiconductor chip with two surfaces, a second semiconductor chip stacked on the first surface of the first chip, and a molding layer that contacts the first surface of the first chip and the sidewall of the second chip. The molding layer includes a first sidewall, a second sidewall, and a flat surface.
- The semiconductor package includes a first semiconductor chip with two surfaces and a second semiconductor chip stacked on top.
- A molding layer is used to connect the first chip's surface and the second chip's sidewall.
- The molding layer consists of a first sidewall, a second sidewall, and a flat surface.
- The first sidewall extends from the lower end of the first chip to a certain height in a perpendicular direction.
- The second sidewall continues from the first height to a second height in the same direction.
- A flat surface extends from the first height in a parallel direction to the first chip's surface.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of semiconductor chips in applications such as smartphones, computers, and automotive electronics.
Problems Solved: - Enhances the structural integrity and thermal management of semiconductor packages. - Facilitates the stacking of multiple chips in a compact and efficient manner.
Benefits: - Improved overall performance and longevity of electronic devices. - Enhanced thermal dissipation capabilities for better efficiency. - Enables the development of smaller and more powerful electronic products.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices, leading to increased market competitiveness and consumer satisfaction. Industries such as telecommunications, automotive, and consumer electronics can benefit from the improved semiconductor packaging technology.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the overall performance of electronic devices? - This technology enhances the structural integrity and thermal management of semiconductor packages, leading to improved efficiency and longevity of electronic devices. 2. What are the potential applications of this advanced semiconductor packaging technology? - This technology can be applied in various industries such as telecommunications, automotive, and consumer electronics to enhance the performance and reliability of electronic devices.
Original Abstract Submitted
a semiconductor package includes a first semiconductor chip including a first surface and a second surface opposite to the first surface, a second semiconductor chip stacked on the first surface of the first semiconductor chip, and a molding layer contacting the first surface of the first semiconductor chip and a sidewall of the second semiconductor chip. the molding layer includes a first sidewall from a lower end of the first semiconductor chip to a first height in a first direction perpendicular to the first surface of the first semiconductor chip, a second sidewall from the first height to a second height in the first direction, and a flat surface that extends from the first height in a second direction that is parallel with the first surface of the first semiconductor chip.
