Samsung electronics co., ltd. (20240321618). SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD simplified abstract
Contents
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD
Organization Name
Inventor(s)
Youngshin Choi of Suwon-si (KR)
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321618 titled 'SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALIGNMENT METHOD
The semiconductor manufacturing apparatus described in the abstract includes a tray with a semiconductor package seated on it, an inspector to check the alignment of the package, a protrusion on the tray's top surface that surrounds the package, and an under vision camera to detect the rotation angle of the package.
- The protrusion on the tray helps to maintain the alignment of the semiconductor package.
- The under vision camera assists in detecting any misalignment or rotation of the package.
- The picker is responsible for moving the semiconductor package between the tray and the area above the under vision camera.
Potential Applications: - Semiconductor manufacturing industry for quality control and alignment of packages.
Problems Solved: - Ensures proper alignment of semiconductor packages during manufacturing. - Detects any misalignment or rotation of the packages accurately.
Benefits: - Improves the efficiency and accuracy of semiconductor manufacturing processes. - Reduces the chances of errors in package alignment.
Commercial Applications: Title: Semiconductor Package Alignment System for Manufacturing Industry This technology can be used in semiconductor manufacturing plants to enhance quality control and streamline production processes.
Questions about Semiconductor Package Alignment System: 1. How does the protrusion on the tray help in maintaining the alignment of the semiconductor package? The protrusion surrounds the package, providing a reference point for alignment and preventing misalignment.
2. What role does the under vision camera play in the semiconductor manufacturing process? The under vision camera detects the rotation angle of the semiconductor package, ensuring accurate alignment during production.
Original Abstract Submitted
a semiconductor manufacturing apparatus includes a semiconductor package. a tray has the semiconductor package seated thereon. an inspector inspects an alignment state of the semiconductor package. a protrusion is on a top surface of the tray and extends in a z direction that is a vertical direction. the protrusion surrounds a side surface of the semiconductor package when the semiconductor package is in an aligned state. the semiconductor package overlaps at least a portion of the protrusion in the z direction when the semiconductor package is in a misaligned state. an under vision camera detects a rotation angle of the semiconductor package with respect to an x-y plane defined in a first horizontal direction x and a second horizontal direction y that cross the z direction. a picker moves the semiconductor package between the tray and an area above the under vision camera.
