Samsung electronics co., ltd. (20240319593). THINNER COMPOSITION AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE BY USING THE SAME simplified abstract

THINNER COMPOSITION AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE BY USING THE SAME

Organization Name

samsung electronics co., ltd.

Inventor(s)

Yool Kang of Suwon-si (KR)

Taehui Kwon of Suwon-si (KR)

Dongjun Kim of Suwon-si (KR)

Ahram Suh of Suwon-si (KR)

Miyeon Jung of Suwon-si (KR)

Samjong Choi of Suwon-si (KR)

Ohhwan Kweon of Hwaseong-si (KR)

Minki Kim of Hwaseong-si (KR)

Jaehyun Kim of Hwaseong-si (KR)

Sunggun Shin of Hwaseong-si (KR)

Seungryul Yoo of Hwaseong-si (KR)

Heekyung Lee of Hwaseong-si (KR)

THINNER COMPOSITION AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE BY USING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240319593 titled 'THINNER COMPOSITION AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE BY USING THE SAME

The patent application describes a thinner composition suitable for extreme ultraviolet (EUV) photoresists, as well as KRF and ARF photoresists, with improved performance in reduced resist coating (RRC) and edge bead removal (EBR), and excellent pipe cleaning capability.

• Thinner composition includes a C2-C4 alkylene glycol C1-C4 alkyl ether acetate, a C2-C3 alkylene glycol C1-C4 alkyl ether, and a cycloketone.
• Suitable for various types of photoresists, including EUV, KRF, and ARF.
• Improves performance in reduced resist coating and edge bead removal processes.
• Excellent pipe cleaning capability for substrate surfaces.
• Enhances overall efficiency and quality of semiconductor manufacturing processes.

Potential Applications: The technology can be applied in semiconductor manufacturing, specifically in the production of advanced photoresists for lithography processes.

Problems Solved: The technology addresses the challenges of improving performance in resist coating and edge bead removal processes, as well as enhancing pipe cleaning capabilities in semiconductor manufacturing.

Benefits: Enhanced performance in resist coating and edge bead removal processes, improved efficiency in substrate surface treatment, and overall quality enhancement in semiconductor manufacturing processes.

Commercial Applications: Title: Advanced Thinner Composition for Semiconductor Manufacturing The technology can be utilized by semiconductor manufacturers to improve the quality and efficiency of lithography processes, leading to enhanced semiconductor device performance.

Questions about the technology: 1. How does the thinner composition improve performance in reduced resist coating and edge bead removal processes? 2. What are the specific benefits of using this thinner composition in semiconductor manufacturing processes?

Original Abstract Submitted

provided are a thinner composition, which may be generally used for an extreme ultraviolet (euv) photoresist as well as krf and arf photoresists and exhibits improved performance in reduced resist coating (rrc) and edge bead removal (ebr), and which has an excellent pipe cleaning capability, and a method of treating a substrate surface by using the thinner composition. the thinner composition includes a c2-c4 alkylene glycol c1-c4 alkyl ether acetate, a c2-c3 alkylene glycol c1-c4 alkyl ether, and a cycloketone.