Samsung electronics co., ltd. (20240319454). SEMICONDUCTOR PACKAGE simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about the Technology
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Junghoon Kang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319454 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in the patent application includes a printed circuit board with a cavity, an optical waveguide, two semiconductor chips, and an interposer.
- The package has a cavity on the printed circuit board, with an optical waveguide extending onto it.
- A first semiconductor chip with a photonic integrated circuit overlaps a portion of the optical waveguide.
- An interposer is placed on the first chip, with a second semiconductor chip on top.
Key Features and Innovation
- Integration of an optical waveguide onto a printed circuit board.
- Photonic integrated circuit on the first semiconductor chip.
- Use of an interposer to connect the two semiconductor chips.
Potential Applications
This technology could be used in:
- Optical communication systems.
- Data transmission devices.
- High-speed computing applications.
Problems Solved
- Improved data transmission efficiency.
- Enhanced optical signal processing.
- Reduction in overall package size.
Benefits
- Increased data transfer speeds.
- Enhanced signal integrity.
- Compact and efficient design.
Commercial Applications
- This technology could be valuable in the telecommunications industry for high-speed data transmission.
- It could also find applications in data centers for improved processing capabilities.
Questions about the Technology
What are the potential limitations of integrating optical waveguides onto printed circuit boards?
Integrating optical waveguides onto printed circuit boards may face challenges related to signal loss and alignment precision. Manufacturers need to address these issues to ensure optimal performance.
How does the photonic integrated circuit on the semiconductor chip improve data processing?
The photonic integrated circuit allows for faster data processing by utilizing light signals instead of electrical signals, leading to higher speeds and efficiency in data transmission.
Original Abstract Submitted
provided is a semiconductor package including a printed circuit board including a cavity extending inward from an upper surface thereof, an optical waveguide extending onto the cavity along the upper surface of the printed circuit board, a first semiconductor chip positioned inside the cavity and including a photonic integrated circuit overlapping a portion of the optical waveguide in a vertical direction, an interposer on the first semiconductor chip, and a second semiconductor chip on the interposer.
