Samsung electronics co., ltd. (20240318040). CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Sanghyun Park of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240318040 titled 'CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
The abstract describes a chemical mechanical polishing (CMP) slurry composition containing an organic booster with an amino acid, a pH adjuster, and inorganic abrasive particles making up less than 0.1% of the total weight, with deionized water (DIW) constituting the remaining part of the composition.
- The CMP slurry composition includes an organic booster with an amino acid, a pH adjuster, and inorganic abrasive particles.
- The inorganic abrasive particles make up less than 0.1% of the total weight of the CMP slurry composition.
- Deionized water (DIW) makes up the remaining part of the CMP slurry composition.
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Optical device fabrication
Problems Solved: - Enhanced polishing efficiency - Improved surface finish - Reduced defects in polished materials
Benefits: - Increased productivity in manufacturing processes - Higher quality finished products - Cost-effective polishing solution
Commercial Applications: Title: Advanced CMP Slurry for Semiconductor Manufacturing This technology can be used in the semiconductor industry for polishing silicon wafers, improving production efficiency and product quality.
Questions about CMP Slurry Composition: 1. How does the organic booster with an amino acid enhance the polishing process? The organic booster with an amino acid helps in achieving a smoother surface finish by promoting material removal during the polishing process.
2. What role does the pH adjuster play in the CMP slurry composition? The pH adjuster helps maintain the optimal pH level for effective polishing and prevents corrosion of the materials being polished.
Original Abstract Submitted
provided is a chemical mechanical polishing (cmp) slurry composition including an organic booster including an amino acid, a ph adjuster, and inorganic abrasive particles of less than 0.1 weight % with respect to a total weight of the cmp slurry composition, wherein a material constituting a remaining part of the cmp slurry composition is deionized water (diw).
