Samsung electronics co., ltd. (20240318038). METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract
METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
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METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240318038 titled 'METHOD OF MANUFACTURING CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
The abstract describes a method of manufacturing a chemical mechanical polishing slurry for semiconductor devices. The method involves mixing precursors containing cerium in an aqueous solution to form nanoclusters, which are then mixed with various additives to create the polishing slurry.
- Mixing precursors containing cerium in an aqueous solution
- Forming nanoclusters through a reaction between the precursors
- Adding pH adjuster, deionized water, inhibitor, booster, and dispersant to the nanoclusters to create the polishing slurry
Potential Applications: - Semiconductor manufacturing - Chemical mechanical polishing processes
Problems Solved: - Efficient polishing of semiconductor devices - Enhanced surface finish and quality
Benefits: - Improved semiconductor device performance - Cost-effective manufacturing process
Commercial Applications: Title: "Advanced Chemical Mechanical Polishing Slurries for Semiconductor Manufacturing" This technology can be used in the production of various semiconductor devices, leading to higher quality products and increased efficiency in the manufacturing process. The market implications include improved competitiveness for semiconductor manufacturers and potential cost savings.
Prior Art: Further research can be conducted in the field of chemical mechanical polishing slurries for semiconductor devices to explore existing technologies and advancements in the industry.
Frequently Updated Research: Stay updated on the latest developments in chemical mechanical polishing slurries for semiconductor manufacturing to ensure the use of cutting-edge technologies in production processes.
Questions about Chemical Mechanical Polishing Slurries: 1. How does the composition of the polishing slurry impact the efficiency of the polishing process? - The composition of the polishing slurry plays a crucial role in determining the polishing rate, surface quality, and overall performance of the semiconductor device. 2. What are the environmental implications of using chemical mechanical polishing slurries in semiconductor manufacturing? - The environmental impact of using these slurries should be considered, and research is ongoing to develop more sustainable alternatives.
Original Abstract Submitted
provided are a method of manufacturing a chemical mechanical polishing slurry and a method of manufacturing a semiconductor device using the same. the method of manufacturing a chemical mechanical polishing slurry includes mixing a first precursor including cerium and a second precursor in an aqueous solution, forming nanoclusters including cerium by a reaction (e.g., a synthesis reaction) between the first precursor and the second precursor, and forming a chemical mechanical polishing slurry by mixing at least one of a ph adjuster, deionized water, an inhibitor, a booster, and a dispersant with the nanoclusters.
