Intel corporation (20240321807). BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS simplified abstract

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS

Organization Name

intel corporation

Inventor(s)

Jonas Croissant of Hillsboro OR (US)

Xavier F. Brun of Chandler AZ (US)

Gustavo Beltran of Chandler AZ (US)

Roberto Serna of Chandler AZ (US)

Ye Seul Nam of Chandler AZ (US)

Timothy Gosselin of Phoenix AZ (US)

Jesus S. Nieto Pescador of Chandler AZ (US)

Dingying David Xu of Chandler AZ (US)

John C. Decker of Tempe AZ (US)

Ifeanyi Okafor of Gilbert AZ (US)

Yiqun Bai of Chandler AZ (US)

BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321807 titled 'BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PACKAGES WITH RESTRICTED UNDERFILL AREAS

The abstract of this patent application describes a multi-die module that includes a first die and a second die coupled together, with the second die having a keep out zone that partially overlaps the first die. An underfill is present between the two dies, with the underfill entirely outside the keep out zone and having a non-vertical edge facing the keep out zone.

• The multi-die module consists of a first die and a second die connected to each other.
• The second die features a keep out zone that overlaps the first die to some extent.
• An underfill is present between the first and second dies.
• The underfill is completely outside the keep out zone and has a non-vertical edge facing the keep out zone.

Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit design

Problems Solved: - Improved thermal management - Enhanced structural integrity - Minimized risk of electrical interference

Benefits: - Increased reliability - Better performance - Cost-effective manufacturing

Commercial Applications: Title: Advanced Multi-Die Modules for Enhanced Electronics Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and automotive systems. It offers improved efficiency, reliability, and durability, making it a valuable innovation for various industries.

Questions about Multi-Die Modules: 1. How does the presence of a keep out zone in the second die benefit the overall structure of the multi-die module? 2. What role does the underfill play in enhancing the performance of the multi-die module?

Frequently Updated Research: Ongoing research in the field of multi-die modules focuses on optimizing the design and materials used to further improve thermal dissipation and electrical performance. Stay updated on the latest advancements to leverage the full potential of this technology.

Original Abstract Submitted

embodiments disclosed herein include multi-die modules. in an embodiment, the multi-die module comprises a first die and a second die coupled to the first die. in an embodiment, the second die comprises a keep out zone that at least partially overlaps the first die. the multi-die module may further comprise an underfill between the first die and the second die. in an embodiment, the underfill is entirely outside the keep out zone, and an edge of the underfill facing the keep out zone is non-vertical.