Intel corporation (20240321785). CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE simplified abstract
Contents
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE
Organization Name
Inventor(s)
Andrew Collins of Chandler AZ (US)
Sujit Sharan of Chandler AZ (US)
Jianyong Xie of Chandler AZ (US)
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321785 titled 'CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITANCE TO SURFACE MOUNTED DIE
The abstract of the patent application describes a package substrate that includes a die package located underneath a power delivery interface in a die, with connection terminals accessible on the surface of the die package. Metal-insulator-metal layers inside the die package are coupled to the connection terminals.
- Die package located underneath power delivery interface in a die
- Connection terminals accessible on surface of die package
- Metal-insulator-metal layers inside die package coupled to connection terminals
Potential Applications: - Semiconductor packaging - Integrated circuits - Electronic devices
Problems Solved: - Efficient power delivery - Enhanced connectivity - Improved signal transmission
Benefits: - Compact design - Enhanced performance - Reliable connection
Commercial Applications: - Semiconductor industry - Electronics manufacturing - Telecommunications sector
Questions about the technology: 1. How does the placement of the die package underneath the power delivery interface improve performance? 2. What are the advantages of having metal-insulator-metal layers inside the die package?
Frequently Updated Research: - Ongoing advancements in semiconductor packaging technology - Research on improving signal transmission in electronic devices
Original Abstract Submitted
a package substrate is disclosed. the package substrate includes a die package in the package substrate located at least partially underneath a location of a power delivery interface in a die that is coupled to the surface of the package substrate. connection terminals are accessible on a surface of the die package to provide connection to the die that is coupled to the surface of the package substrate. metal-insulator-metal layers inside the die package are coupled to the connection terminals.
