Intel corporation (20240321754). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES simplified abstract
Contents
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES
Organization Name
Inventor(s)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321754 titled 'INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES
The patent application describes microelectronic assemblies with strengthened glass layers, along with related devices and methods.
- Glass layer with first and second surfaces, side surfaces, and material (epoxy, mold, or dielectric) on all surfaces
- Via extending through the glass layer and material, including conductive material
- Dielectric layer on the material at the first surface, with a conductive pathway electrically coupled to the via
Potential Applications: - Microelectronics - Semiconductor devices - Electronic packaging
Problems Solved: - Strengthening glass layers in microelectronic assemblies - Enhancing conductivity and electrical coupling in devices
Benefits: - Improved durability and reliability of microelectronic assemblies - Enhanced electrical performance - Increased functionality in electronic devices
Commercial Applications: Title: Enhanced Microelectronic Assemblies for Improved Performance This technology can be used in various industries such as consumer electronics, telecommunications, and automotive for more robust and efficient electronic devices.
Questions about the technology: 1. How does the strengthened glass layer impact the overall performance of microelectronic assemblies? 2. What are the specific advantages of using a conductive pathway in the dielectric layer for electrical coupling?
Original Abstract Submitted
disclosed herein are microelectronic assemblies including strengthened glass layers, as well as related devices and methods. in some embodiments, a microelectronic assembly may include a glass layer having a first surface, an opposing second surface, and side surfaces extending between the first and second surfaces; a material on the first, second, and side surfaces of the glass layer, the material including an epoxy material, a mold material, or a dielectric material; a via extending through the glass layer and through the material on the first and second surfaces, the via including a conductive material; and a dielectric layer on the material at the first surface of the glass layer, the dielectric layer including a conductive pathway electrically coupled to the via.
