Intel corporation (20240321657). PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME

Organization Name

intel corporation

Inventor(s)

Darko Grujicic of Chandler AZ (US)

Suddhasattwa Nad of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Rengarajan Shanmugam of Tempe AZ (US)

Marcel Wall of Phoenix AZ (US)

Sashi Kandanur of Chandler AZ (US)

Rahul Manepalli of Chandler AZ (US)

Robert May of Chandler AZ (US)

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240321657 titled 'PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING THE SAME

The abstract of the patent application describes photonic integrated circuit packages and methods of manufacturing.

• The integrated circuit package includes a semiconductor die and a package substrate with a glass core.
• The glass core has a through glass via and a recess with a reflective metal defining a mirror.
• The reflective metal is also between the wall of the through glass via and a conductive material in the via.

Potential Applications: This technology can be used in the development of advanced photonic integrated circuits for various applications in telecommunications, data centers, and optical networking.

Problems Solved: This innovation addresses the need for compact and efficient packaging solutions for photonic integrated circuits, improving performance and reliability.

Benefits: The use of glass core substrates with reflective metal mirrors can enhance signal integrity, reduce signal loss, and improve overall performance of photonic integrated circuits.

Commercial Applications: This technology has significant commercial potential in the telecommunications industry, where high-speed data transmission and optical networking are crucial for efficient communication systems.

Questions about Photonic Integrated Circuit Packages: 1. How does the use of glass core substrates improve the performance of photonic integrated circuits? Glass core substrates provide a stable and reliable platform for integrating semiconductor dies, reducing signal loss and improving signal integrity in photonic integrated circuits.

2. What are the key advantages of using reflective metal mirrors in photonic integrated circuit packages? Reflective metal mirrors help to enhance the efficiency of signal transmission, reduce signal loss, and improve the overall performance of photonic integrated circuits.

Original Abstract Submitted

photonic integrated circuit packages and methods of manufacturing are disclosed. an example integrated circuit package includes: a semiconductor die; a package substrate supporting the semiconductor die, the package substrate including a glass core, the glass core including a through glass via extending between opposing first and second surfaces of the glass core, the glass core including a recess spaced apart from the through glass via, the recess defined by a third surface of the glass core, the recess having a different shape than the through glass via; and a reflective metal disposed on the third surface to define a mirror, the reflective metal also disposed between a wall of the through glass via and a conductive material disposed in the through glass via.