Intel corporation (20240319457). UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES simplified abstract

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UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES

Organization Name

intel corporation

Inventor(s)

Chia-Pin Chiu of Tempe AZ (US)

Kaveh Hosseini of Livermore CA (US)

UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240319457 titled 'UNDERCUT ARCHITECTURES FOR IMPROVED THERMAL EFFICIENCY IN PHOTONIC INTEGRATED CIRCUIT (PIC) ARCHITECTURES

Simplified Explanation: In one embodiment, a photonic integrated circuit (PIC) device includes conductive pads, a micro ring resonator (MRR) with a heater element, a cavity, and holes defined within the substrate of the PIC.

  • The PIC device has conductive pads on its surface and a centrally located heater element in the MRR.
  • A cavity is defined within the substrate below the MRR, and holes are present between the MRR and the conductive pads.
  • The holes extend from the top surface of the PIC into the cavity, with each hole located between a conductive pad and the MRR.

Key Features and Innovation:

  • Integration of conductive pads, MRR with a heater element, cavity, and holes in a PIC device.
  • Central location of the heater element in the MRR for efficient heating.
  • Holes extending from the top surface of the PIC into the cavity for enhanced functionality.

Potential Applications: The technology can be applied in telecommunications, optical signal processing, and sensing applications.

Problems Solved:

  • Efficient heating of the MRR in a PIC device.
  • Enhanced functionality and performance in optical applications.

Benefits:

  • Improved heating efficiency.
  • Enhanced functionality and performance in optical applications.

Commercial Applications: Potential commercial applications include telecommunications equipment, optical sensors, and data communication devices.

Questions about Photonic Integrated Circuit (PIC) Devices: 1. What are the key components of a photonic integrated circuit (PIC) device? 2. How does the integration of conductive pads, MRR, cavity, and holes enhance the functionality of a PIC device?

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Original Abstract Submitted

in one embodiment, a photonic integrated circuit (pic) device includes conductive pads on a surface of the pic and a micro ring resonator (mrr) with a heater element centrally located between the conductive pads. the pic also includes a cavity defined within a substrate of the pic below the mrr, and a plurality of holes defined between the mrr and the conductive pads. the holes extend from a top surface of the pic into the cavity, and each hole is between a respective conductive pad and the mrr.