18120900. Circuit Board Cooling Configurations simplified abstract (Microsoft Technology Licensing, LLC)

Circuit Board Cooling Configurations

Organization Name

Microsoft Technology Licensing, LLC

Inventor(s)

Ruslan Nagimov of Redmond WA (US)

Circuit Board Cooling Configurations - A simplified explanation of the abstract

This abstract first appeared for US patent application 18120900 titled 'Circuit Board Cooling Configurations

The abstract discusses thermal management in a circuit board with cryogenically cooled chips and non-cryogenic electronic components.

• Simplified Explanation:

The patent application describes a circuit board with different zones to manage thermal energy, including a cryogenically cooled chip in the inner zone and non-cryogenic components in the outer zone.

• Key Features and Innovation:

- Circuit board with inner, intermediate, and outer zones - Cryogenically cooled chip in the inner zone - Skeletonized configuration in the intermediate zone to slow thermal energy movement

• Potential Applications:

- High-performance computing - Aerospace and defense systems - Automotive electronics

• Problems Solved:

- Efficient thermal management in electronic devices - Prevention of overheating in high-power applications

• Benefits:

- Improved performance and reliability - Extended lifespan of electronic components - Enhanced safety in critical systems

• Commercial Applications:

- Data centers - Telecommunications infrastructure - Medical equipment manufacturing

• Questions about Thermal Management:

1. How does the skeletonized configuration in the intermediate zone help in thermal management? 2. What are the advantages of using cryogenically cooled chips in electronic devices?

• Frequently Updated Research:

- Ongoing studies on advanced thermal management techniques - Research on the impact of cryogenic cooling on electronic components

By providing a detailed and informative overview of the thermal management technology described in the patent application, readers can gain a better understanding of its potential applications, benefits, and commercial implications.

Original Abstract Submitted

The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.