18605316. WAVELENGTH CONVERSION DEVICE, METHOD OF MANUFACTURING WAVELENGTH CONVERSION DEVICE, ILLUMINATION DEVICE, AND PROJECTOR simplified abstract (SEIKO EPSON CORPORATION)
WAVELENGTH CONVERSION DEVICE, METHOD OF MANUFACTURING WAVELENGTH CONVERSION DEVICE, ILLUMINATION DEVICE, AND PROJECTOR
Organization Name
Inventor(s)
Toshiaki Hashizume of OKAYA-SHI (JP)
WAVELENGTH CONVERSION DEVICE, METHOD OF MANUFACTURING WAVELENGTH CONVERSION DEVICE, ILLUMINATION DEVICE, AND PROJECTOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18605316 titled 'WAVELENGTH CONVERSION DEVICE, METHOD OF MANUFACTURING WAVELENGTH CONVERSION DEVICE, ILLUMINATION DEVICE, AND PROJECTOR
Simplified Explanation: The patent application describes a wavelength conversion device with a substrate, a wavelength conversion layer containing phosphor particles, a bonding member to bond the particles and substrate, and a reflecting layer to reflect light.
Key Features and Innovation:
- Phosphor particles have a size distribution of 40-200 μm, with a center value of 70-150 μm.
- Some particles are thermally coupled to the reflecting layer.
- 50% or more of the particles are thermally coupled to each other.
- The bonding member thickness is 30-80% of the wavelength conversion layer thickness.
Potential Applications: This technology can be used in lighting systems, displays, and optical communication devices.
Problems Solved: The device improves light conversion efficiency and thermal management in various applications.
Benefits:
- Enhanced light conversion efficiency
- Improved thermal management
- Increased durability and reliability
Commercial Applications: Potential commercial applications include LED lighting systems, digital signage, and projection displays.
Questions about Wavelength Conversion Devices: 1. How does the size distribution of phosphor particles impact the performance of the device? 2. What are the advantages of thermal coupling between phosphor particles and the reflecting layer?
Original Abstract Submitted
A wavelength conversion device includes a substrate, a wavelength conversion layer disposed on the substrate and including a plurality of phosphor particles and a bonding member configured to bond the phosphor particles and the substrate to each other, and a reflecting layer disposed between the substrate and the wavelength conversion layer and configured to reflect light. A particle size distribution of the phosphor particles is no smaller than 40 μm and no larger than 200 μm. A center value of the particle size distribution is no smaller than 70 μm and no larger than 150 μm. Some of the phosphor particles are thermally coupled to the reflecting layer. 50% or more of the phosphor particles are thermally coupled to each other. A thickness of the bonding member is no smaller than 30% and no larger than 80% of a thickness of the wavelength conversion layer.
