18603279. Liquid Ejecting Head Manufacturing Method, Liquid Ejecting Head, And Liquid Ejecting Apparatus simplified abstract (SEIKO EPSON CORPORATION)
Contents
Liquid Ejecting Head Manufacturing Method, Liquid Ejecting Head, And Liquid Ejecting Apparatus
Organization Name
Inventor(s)
Haruki Kobayashi of Matsumoto (JP)
Liquid Ejecting Head Manufacturing Method, Liquid Ejecting Head, And Liquid Ejecting Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 18603279 titled 'Liquid Ejecting Head Manufacturing Method, Liquid Ejecting Head, And Liquid Ejecting Apparatus
Simplified Explanation: The patent application describes a method for manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head. This involves replacing the first head chip with a compatible second head chip.
- The method involves replacing the first head chip with a second head chip compatible with the first head chip.
- The replacement process includes releasing the adhesion state between the first selection coupling portion and the first head chip, and then coupling the second selection coupling portion with the second head chip using an adhesive.
Key Features and Innovation:
- Regenerating a liquid ejecting head by replacing the head chip with a compatible one.
- Releasing the adhesion state between the flow path structure and the head chip.
- Coupling the new head chip using an adhesive for a liquid-tight connection.
Potential Applications: This technology can be used in the manufacturing of liquid ejecting heads for various printing and dispensing applications.
Problems Solved:
- Allows for the regeneration of liquid ejecting heads, reducing the need for complete replacements.
- Ensures compatibility between different head chips for seamless integration.
Benefits:
- Cost-effective regeneration of liquid ejecting heads.
- Improved sustainability by reducing electronic waste.
- Enhanced compatibility and functionality of liquid ejecting systems.
Commercial Applications: Liquid ejecting head manufacturers can utilize this technology to offer regeneration services for their products, extending the lifespan of their equipment and reducing overall costs for customers.
Questions about Liquid Ejecting Head Manufacturing Method: 1. How does the replacement of the head chip impact the overall performance of the liquid ejecting head? 2. What are the specific adhesive materials used in the coupling process?
2. Another relevant generic question, with a detailed answer. What are the potential environmental benefits of regenerating liquid ejecting heads instead of replacing them entirely?
This article provides a detailed overview of a method for regenerating liquid ejecting heads by replacing the head chip, offering insights into the innovation, applications, and benefits of this technology.
Original Abstract Submitted
There is provided a liquid ejecting head manufacturing method of manufacturing a second liquid ejecting head by regenerating a first liquid ejecting head that includes a first head chip ejecting a liquid, and a flow path structure having a first selection coupling portion and a second selection coupling portion that are flow path coupling portions to the first head chip, the method including: a replacing step of replacing the first head chip with a second head chip compatible with the first head chip, in which the replacing step includes a first step of releasing an adhesion state where the first selection coupling portion and the first head chip are liquid-tightly coupled, and a second step of liquid-tightly coupling the second selection coupling portion compatible with the first selection coupling portion and the second head chip by an adhesive.
