18450774. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Tsuyoshi Kachi of Kanazawa Ishikawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18450774 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract consists of multiple components including electrodes, insulating films, conductive members, and an insulating body within the semiconductor part.
- The first electrode is connected to the third electrode, while the second electrode is connected to the second conductive member.
- The third conductive member extends from a region under the second electrode to at least a region under the third electrode, connecting to the semiconductor part and the second electrode.
- An insulating body is located within the semiconductor part, with a first conductive member and a second conductive member interposed within it.
Potential Applications: - This semiconductor device could be used in various electronic applications requiring precise control of electrical currents. - It may find applications in sensors, actuators, or other devices where efficient electrical connections are crucial.
Problems Solved: - The device provides a reliable and efficient way to connect different components within a semiconductor structure. - It addresses the need for stable and secure electrical connections in complex electronic systems.
Benefits: - Improved performance and reliability in electronic devices. - Enhanced control over electrical currents within the semiconductor structure.
Commercial Applications: Title: Advanced Semiconductor Device for Enhanced Electrical Connections This technology could be valuable in the development of high-performance electronic devices, potentially impacting industries such as telecommunications, automotive, and consumer electronics.
Prior Art: Readers interested in exploring prior art related to this technology may start by researching semiconductor device structures and methods for enhancing electrical connections in electronic components.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor device technology, particularly in the field of improving electrical connections within complex structures.
Questions about Semiconductor Devices: 1. How does the design of this semiconductor device contribute to its overall performance and reliability? 2. What are the potential limitations or challenges associated with implementing this technology in practical electronic applications?
Original Abstract Submitted
A semiconductor device includes a first electrode, a semiconductor part located on the first electrode, an insulating film located on the semiconductor part, a second electrode located on the insulating film, a third electrode located on the insulating film, an insulating body located in the semiconductor part, a first conductive member located in the semiconductor part with the insulating body interposed, a second conductive member located in the insulating body, and a third conductive member located in the semiconductor part. The first conductive member is connected to the third electrode. The second conductive member is connected to the second electrode. The third conductive member extends in a first direction from a region directly under the second electrode to at least a region directly under the third electrode. The third conductive member is connected to the semiconductor part and the second electrode.
