18467581. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Daisuke Koike of Tama Tokyo (JP)
Hisashi Tomita of Yokohama Kanagawa (JP)
Yuning Tsai of Yokohama Kanagawa (JP)
Yutaro Hayashi of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18467581 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
The semiconductor device described in the abstract includes a semiconductor chip, a conductive sheet on the chip, and a metal plate on the conductive sheet. The metal plate has a step portion on a lateral surface or a groove portion on a bottom surface.
- The semiconductor device features a metal plate with a unique step or groove portion design.
- The conductive sheet enhances the performance of the semiconductor chip.
- The metal plate provides additional functionality and structural support to the device.
- The step portion or groove portion on the metal plate adds versatility to the device's design.
- This innovation aims to improve the efficiency and reliability of semiconductor devices.
Potential Applications: - This technology can be applied in various electronic devices requiring semiconductor components. - It can be used in telecommunications equipment, consumer electronics, and industrial machinery.
Problems Solved: - Enhances the structural integrity of semiconductor devices. - Improves the thermal management of the semiconductor chip. - Provides a more efficient electrical connection within the device.
Benefits: - Increased performance and reliability of semiconductor devices. - Enhanced thermal dissipation capabilities. - Versatile design options for different applications.
Commercial Applications: - This technology can be utilized in the manufacturing of smartphones, computers, and automotive electronics. - It has potential applications in the aerospace and defense industries for advanced electronic systems.
Questions about the Semiconductor Device: 1. How does the metal plate design impact the overall performance of the semiconductor device? 2. What specific advantages does the conductive sheet provide in this technology?
Frequently Updated Research: - Stay updated on the latest advancements in semiconductor device technology to ensure optimal performance and reliability in electronic devices.
Original Abstract Submitted
A semiconductor device according to an embodiment includes: a semiconductor chip; a conductive sheet provided on the semiconductor chip; and a metal plate provided on the conductive sheet. The metal plate has a step portion that is provided on a lateral surface, or a groove portion that is provided on a bottom surface.
