18151416. EUV MASKS TO PREVENT CARBON CONTAMINATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

From WikiPatents
Revision as of 01:58, 4 January 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

EUV MASKS TO PREVENT CARBON CONTAMINATION

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Pei-Cheng Hsu of Taipei City (TW)

Ta-Cheng Lien of Hsinchu County (TW)

Hsin-Chang Lee of Hsinchu County (TW)

EUV MASKS TO PREVENT CARBON CONTAMINATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18151416 titled 'EUV MASKS TO PREVENT CARBON CONTAMINATION

Simplified Explanation

The patent application describes a method for forming a multi-layered reflective layer over a substrate, followed by the deposition of various metal and metal oxide layers. Features are then formed on the top layers.

  • The method involves the formation of a multi-layered reflective layer over a substrate.
  • A metal capping layer is deposited over the reflective layer.
  • A first metal oxide layer is deposited over the metal capping layer.
  • A metal nitride layer is deposited over the first metal oxide layer.
  • A second metal oxide layer is deposited over the metal nitride layer.
  • Features are formed on the second metal oxide layer and the metal nitride layer.

Potential Applications

  • Optical coatings
  • Photovoltaic devices
  • Display technologies
  • Semiconductor manufacturing

Problems Solved

  • Improved reflective properties
  • Enhanced durability and resistance to degradation
  • Increased efficiency of optical devices
  • Better performance of semiconductor devices

Benefits

  • Higher reflectivity
  • Improved optical performance
  • Increased device efficiency
  • Enhanced durability and longevity


Original Abstract Submitted

A method includes forming a multi-layered reflective layer over a substrate; depositing a metal capping layer over the multi-layered reflective layer; depositing a first metal oxide layer over the metal capping layer; depositing a metal nitride layer over the first metal oxide layer; depositing a second metal oxide layer over the metal nitride layer; forming a plurality of features on the second metal oxide layer and the metal nitride layer.