18226328. INTERCONNECTS AT BACK SIDE OF SEMICONDUCTOR DEVICE FOR SIGNAL ROUTING simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
INTERCONNECTS AT BACK SIDE OF SEMICONDUCTOR DEVICE FOR SIGNAL ROUTING
Organization Name
Inventor(s)
Jintae Kim of Clifton Park NY (US)
Panjae Park of Halfmoon NY (US)
Kang-ill Seo of Springfield VA (US)
INTERCONNECTS AT BACK SIDE OF SEMICONDUCTOR DEVICE FOR SIGNAL ROUTING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18226328 titled 'INTERCONNECTS AT BACK SIDE OF SEMICONDUCTOR DEVICE FOR SIGNAL ROUTING
Simplified Explanation: The semiconductor device described in the patent application includes a frontside metal line on the front side and a backside metal line on the back side, with the backside metal line connected to the frontside metal line.
Key Features and Innovation:
- Semiconductor device with frontside and backside metal lines.
- Connection between the frontside and backside metal lines.
Potential Applications: This technology could be used in various semiconductor devices where frontside and backside metal lines need to be connected for improved functionality.
Problems Solved:
- Ensures efficient connectivity between frontside and backside metal lines.
- Enhances the performance of semiconductor devices.
Benefits:
- Improved functionality of semiconductor devices.
- Enhanced connectivity between metal lines.
- Potential for increased efficiency in electronic devices.
Commercial Applications: The technology could have applications in the semiconductor industry for the development of more advanced and efficient electronic devices.
Questions about Semiconductor Devices with Frontside and Backside Metal Lines: 1. What are the key features of a semiconductor device with frontside and backside metal lines? 2. How does the connection between the frontside and backside metal lines improve the performance of the device?
Frequently Updated Research: Researchers in the semiconductor industry are constantly exploring new ways to improve the connectivity and efficiency of electronic devices, which could lead to further advancements in this technology.
Original Abstract Submitted
Provided is a semiconductor device including a 1frontside metal line at a front side of the semiconductor device; and a 1backside metal line at a back side of the semiconductor device, wherein the 1backside metal line is connected to the 1frontside metal line.
