18671649. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

From WikiPatents
Revision as of 09:46, 19 September 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sung-Min Hwang of Hwaseong-si, (KR)

Jiwon Kim of Seoul (KR)

Jaeho Ahn of Seoul (KR)

Joon-Sung Lim of Seongnam-si (KR)

Sukkang Sung of Seongnam-si (KR)

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18671649 titled 'SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

The semiconductor device and electronic system described in the abstract consist of a cell structure stacked on a peripheral circuit structure. The cell structure includes a first interlayer dielectric layer and first metal pads connected to gate electrode layers and channel regions. The peripheral circuit structure includes a second interlayer dielectric layer and second metal pads connected to a transistor.

  • The first metal pads consist of adjacent first and second sub-pads, while the second metal pads consist of adjacent third and fourth sub-pads.
  • The first and third sub-pads are coupled, with the width of the first sub-pad being greater than that of the third sub-pad.
  • The second and fourth sub-pads are coupled, with the width of the fourth sub-pad being greater than that of the second sub-pad.

Potential Applications: - This technology can be applied in the manufacturing of advanced semiconductor devices for various electronic systems. - It can enhance the performance and efficiency of integrated circuits in electronic devices.

Problems Solved: - This technology addresses the need for improved connectivity and functionality in semiconductor devices. - It solves the challenge of optimizing space and layout in complex electronic systems.

Benefits: - Enhanced connectivity and functionality in semiconductor devices. - Improved performance and efficiency of integrated circuits. - Optimal space utilization and layout design in electronic systems.

Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Electronic Systems This technology can be commercially utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers. It can also benefit industries requiring advanced semiconductor technology, such as telecommunications and automotive.

Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of semiconductor device manufacturing, integrated circuits, and electronic system design.

Frequently Updated Research: Researchers and industry professionals can stay updated on advancements in semiconductor device technology by following publications and conferences in the field of microelectronics, nanotechnology, and semiconductor materials.

Questions about Semiconductor Device Technology: 1. How does this technology improve the connectivity and functionality of semiconductor devices? 2. What are the potential applications of this advanced semiconductor device technology in various electronic systems?


Original Abstract Submitted

A semiconductor device and electronic system, the device including a cell structure stacked on a peripheral circuit structure, wherein the cell structure includes a first interlayer dielectric layer and first metal pads exposed at the first interlayer dielectric layer and connected to gate electrode layers and channel regions, the peripheral circuit structure includes a second interlayer dielectric layer and second metal pads exposed at the second interlayer dielectric layer and connected to a transistor, the first metal pads include adjacent first and second sub-pads, the second metal pads include adjacent third and fourth sub-pads, the first and third sub-pads are coupled, and a width of the first sub-pad is greater than that of the third sub-pad, and the second sub-pad and the fourth sub-pad are coupled, and a width of the fourth sub-pad is greater than that of the second sub-pad.