18677075. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Byeongchan Kim of Asan-si (KR)
Jumyong Park of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18677075 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes an interposer with bonding pads and two semiconductor devices.
- The bonding pads on the interposer have two patterns: a first pad pattern exposed on the first surface with a certain width, and a second pad pattern on top of the first pattern with a wider width.
- The first and second semiconductor devices are mounted on the interposer, utilizing the bonding pads for connectivity.
Potential Applications:
- This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices.
- It can enhance the performance and reliability of semiconductor devices by providing a more efficient bonding pad design.
Problems Solved:
- This innovation addresses the need for improved connectivity and signal transmission in semiconductor packages.
- It solves the challenge of optimizing space utilization on the interposer for multiple semiconductor devices.
Benefits:
- Increased efficiency in signal transmission and connectivity.
- Enhanced performance and reliability of semiconductor devices.
- Improved space utilization on the interposer for compact designs.
Commercial Applications:
- This technology can be applied in the production of high-performance electronic devices such as smartphones, tablets, and computers.
- It has potential implications in the semiconductor industry for developing cutting-edge products.
Questions about the Technology: 1. How does the design of the bonding pads on the interposer contribute to the overall performance of the semiconductor package? 2. What are the specific advantages of having two different pad patterns on the bonding pads for connecting semiconductor devices?
Original Abstract Submitted
A semiconductor package includes an interposer having a first surface and a second surface opposite to the first surface and including a plurality of bonding pads, and first and second semiconductor devices on the interposer. Each of the plurality of bonding pads includes a first pad pattern provided to be exposed from the first surface and having a first width and a second pad pattern provided on the first pad pattern and having a second width greater than the first width.
