18371774. METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME
Organization Name
Inventor(s)
Seunghun Shin of Suwon-si (KR)
METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18371774 titled 'METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME
The method described in the abstract involves splitting a semiconductor chip by performing a back-end-of-line (BEOL) process, forming chip areas and a splitting area on a semiconductor substrate, and using a mechanical machining device to separate the chip areas.
- Formation of chip areas and a splitting area on a semiconductor substrate
- Use of a wire on the first surface of the semiconductor substrate
- Creation of a cutout auxiliary layer in the splitting area
- Mechanical machining using a mechanical machining device on the cutout auxiliary layer
- Cutout auxiliary layer is adjacent to the chip areas
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit production
Problems Solved: - Efficient and precise splitting of semiconductor chips - Enhanced manufacturing processes - Improved chip yield and quality
Benefits: - Increased productivity in semiconductor fabrication - Cost-effective chip splitting method - Enhanced overall performance of electronic devices
Commercial Applications: Title: Semiconductor Chip Splitting Method for Enhanced Manufacturing Processes This technology can be utilized in semiconductor manufacturing facilities to streamline chip splitting processes, leading to improved efficiency and cost savings. The method can be integrated into various stages of semiconductor production, enhancing overall productivity and quality.
Questions about the technology: 1. How does the method of mechanical machining contribute to the efficiency of splitting semiconductor chips? 2. What are the potential cost savings associated with implementing this chip splitting technique in semiconductor manufacturing?
Original Abstract Submitted
Provide is a method of splitting a semiconductor chip, the method including performing a back-end-of-line (BEOL) process including forming a plurality of chip areas on a semiconductor substrate, forming a splitting area, which separates the plurality of chip areas, on the semiconductor substrate, and forming a wire on a first surface of the semiconductor substrate, forming a cutout auxiliary layer in the splitting area of the first surface of the semiconductor substrate, and performing mechanical machining by bringing a mechanical machining device into contact with the cutout auxiliary layer, wherein the cutout auxiliary layer is adjacent to the plurality of chip areas.
