18594573. THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME simplified abstract (MEDIATEK Inc.)
Contents
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME
Organization Name
Inventor(s)
Shu-Wei Hsiao of Hsinchu City (TW)
Chung-Fa Lee of Hsinchu City (TW)
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18594573 titled 'THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME
Simplified Explanation: The patent application describes a substrate structure and a package assembly that includes the substrate structure. The substrate structure consists of various traces, through-hole vias, and a bridge trace, all thermally connected to each other.
- The substrate structure includes a first trace, a second trace, a first through-hole via (THV), a second THV, and a bridge trace.
- The first trace has two pad portions separated from each other, with the first THV passing through the first pad portion and the second THV passing through the second pad portion.
- The bridge trace is formed in the substrate structure and is thermally connected to both the first and second THVs.
Key Features and Innovation:
- Substrate structure with multiple traces and through-hole vias.
- Bridge trace for thermal connection between different components.
- Efficient design for improved thermal management.
Potential Applications:
- Electronics packaging.
- Circuit board manufacturing.
- Semiconductor devices.
Problems Solved:
- Enhanced thermal performance.
- Improved signal integrity.
- Space-saving design.
Benefits:
- Better heat dissipation.
- Reliable electrical connections.
- Compact and efficient layout.
Commercial Applications: Title: Advanced Substrate Structure for Enhanced Thermal Management in Electronics Packaging This technology can be utilized in various industries such as telecommunications, automotive, and consumer electronics for improved performance and reliability in electronic devices.
Prior Art: Readers can explore prior patents related to substrate structures, thermal management in electronics, and circuit board design to understand the evolution of this technology.
Frequently Updated Research: Researchers are constantly exploring new materials and manufacturing techniques to further enhance the thermal performance and efficiency of substrate structures in electronic packaging.
Questions about Substrate Structure: 1. How does the bridge trace in the substrate structure contribute to thermal management? 2. What are the potential challenges in implementing this advanced substrate structure in mass production?
Original Abstract Submitted
A substrate structure and a package assembly with the substrate structure are provided. The substrate structure includes a first trace, a second trace, a first through-hole via (THV), a second THV formed in a build-up layer and a bridge trace. The first trace includes a first pad portion and a second pad portion separated from the first pad portion and arranged near a corner of the first pad portion. The first THV passes through the first pad portion and the second THV passes through the second pad portion. The first bridge trace formed in the substrate structure and thermally connected to the second THV and the first THV.
