Sk hynix inc. (20240312509). BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE simplified abstract

From WikiPatents
Revision as of 08:58, 19 September 2024 by Wikipatents (talk | contribs) (Creating a new page)
(diff) ← Older revision | Latest revision (diff) | Newer revision → (diff)
Jump to navigation Jump to search

BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE

Organization Name

sk hynix inc.

Inventor(s)

Choung Ki Song of Icheon-si Gyeonggi-do (KR)

BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240312509 titled 'BUFFER CHIP, SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP AND MEMORY CHIP, AND MEMORY MODULE

Simplified Explanation

The patent application describes a buffer chip that receives chip select signals from a memory controller, maps them using failed memory chip information, and transmits them to multiple memory chips.

  • Chip select signals are received from a memory controller.
  • The signals are mapped using information about failed memory chips.
  • The mapped signals are then transmitted to multiple memory chips.

Key Features and Innovation

  • Reception of chip select signals from a memory controller.
  • Mapping of signals using failed memory chip information.
  • Transmission of mapped signals to multiple memory chips.

Potential Applications

This technology can be used in various memory systems where efficient mapping of chip select signals is required for optimal performance.

Problems Solved

This technology addresses the need for effective mapping of chip select signals in memory systems, especially when dealing with failed memory chips.

Benefits

  • Improved efficiency in managing chip select signals.
  • Enhanced performance in memory systems.
  • Better utilization of memory chips.

Commercial Applications

  • Memory chip manufacturing industry.
  • Computer hardware companies.
  • Data centers and server farms.

Prior Art

Readers can explore prior patents related to buffer chips, memory systems, and chip select signal mapping to understand the existing technology landscape.

Frequently Updated Research

Stay updated on advancements in buffer chip technology, memory systems, and signal mapping techniques to leverage the latest innovations in the field.

Questions about Buffer Chip Technology

How does the buffer chip improve memory system performance?

The buffer chip enhances performance by efficiently mapping chip select signals, ensuring optimal communication with memory chips.

What are the potential challenges in implementing this technology in memory systems?

Implementing this technology may require compatibility with existing memory controllers and memory chip configurations, posing integration challenges that need to be addressed.


Original Abstract Submitted

a buffer chip may include: a chip select signal reception circuit configured to receive system chip select signals transmitted from a memory controller; a chip select signal mapping circuit configured to generate memory chip select signals by mapping the system chip select signals by using failed memory chip information; and a chip select signal transmission circuit configured to transmit the memory chip select signals to a plurality of memory chips.