Panasonic intellectual property management co., ltd. (20240312841). ELEMENT CHIP MANUFACTURING METHOD simplified abstract
Contents
ELEMENT CHIP MANUFACTURING METHOD
Organization Name
panasonic intellectual property management co., ltd.
Inventor(s)
Hidehiko Karasaki of HYOGO (JP)
Toshiyuki Takasaki of OSAKA (JP)
ELEMENT CHIP MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312841 titled 'ELEMENT CHIP MANUFACTURING METHOD
The abstract of this patent application describes a method for manufacturing element chips, involving processes such as preparing a substrate with various layers, forming a resin layer, creating openings, reducing the openings through reflow, and finally singulating the substrate into individual element chips.
- Preparation process of substrate with semiconductor layer, wiring layer, element areas, and dividing area
- Resin layer formation process to cover the wiring layer
- Opening formation process to expose the semiconductor layer in the dividing area
- Reflow process to reduce the opening size
- Singulation process to divide the substrate into individual element chips using plasma etching along the reduced openings
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit production
Problems Solved: - Efficient manufacturing of element chips - Precise exposure of semiconductor layer - Uniform singulation of substrates
Benefits: - Improved production efficiency - Enhanced chip quality - Cost-effective manufacturing process
Commercial Applications: Title: "Advanced Element Chip Manufacturing Method for Semiconductor Industry" This technology can be utilized in semiconductor fabrication facilities to streamline the production of high-quality element chips, catering to the growing demand for advanced electronic devices in the market.
Questions about the technology: 1. How does this method compare to traditional element chip manufacturing processes? 2. What are the key advantages of using plasma etching for singulation in this method?
Frequently Updated Research: Researchers in the semiconductor industry are constantly exploring new materials and techniques to enhance the performance and efficiency of element chip manufacturing processes. Stay updated on the latest advancements in semiconductor technology to leverage cutting-edge innovations in your production processes.
Original Abstract Submitted
an element chip manufacturing method disclosed herein includes a preparation process of preparing a substrate having a semiconductor layer, a wiring layer, a plurality of element areas and a dividing area, a resin layer formation process of forming a resin layer covering the wiring layer, an opening formation process of irradiating the wiring layer and the resin layer in the dividing area to form an opening in which the semiconductor layer is exposed in the dividing area, a reflow process of reducing the opening by reflowing the resin layer, and a singulation process of dividing the substrate into a plurality of element chips each including a different one of the element areas, by performing etching of the substrate with plasma along the opening reduced in the reflow process, using the resin layer as a mask.
