17754896. SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE simplified abstract (Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.)

SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE

Organization Name

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Inventor(s)

Zhuhui Li of Shenzhen, Guangdong (CN)

SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17754896 titled 'SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE

The abstract of this patent application describes a solder-printing stencil and a method of printing solder paste on a substrate using the stencil in cooperation with a squeegee blade.

• The solder-printing stencil includes a stencil body with three regions, one of which has mesh holes for squeegeeing the solder paste.
• Protruding portions on the stencil body facing the substrate aid in the printing process.

Potential Applications: - Electronics manufacturing - PCB assembly processes

Problems Solved: - Precise and efficient solder paste printing - Consistent results in soldering processes

Benefits: - Improved accuracy in solder paste application - Enhanced quality control in electronics manufacturing

Commercial Applications: - Soldering equipment manufacturers - Electronics contract manufacturers

Questions about Solder-Printing Stencils: 1. How does the design of the solder-printing stencil contribute to the efficiency of the solder paste printing process? 2. What are the key factors to consider when selecting a solder-printing stencil for a specific application?

Frequently Updated Research: - Ongoing studies on the optimization of solder paste printing techniques in electronics manufacturing.

Original Abstract Submitted

A solder-printing stencil and a method of printing solder paste are provided in the present application. A solder-printing stencil is used for printing a solder paste on a substrate in cooperation with a squeegee blade, the solder-printing stencil includes: a stencil body including a first region, a second region, and a third region, wherein the third region is defined between the first region and the second region, the third region is provided with a plurality of mesh holes spaced along a squeegeeing direction of the squeegee blade; and protruding portions are provided on a side of the stencil body facing the substrate, and the protruding portions are provided on both the first region and the second region.