18119270. PACKAGE STRUCTURE simplified abstract (Advanced Semiconductor Engineering, Inc.)
Contents
PACKAGE STRUCTURE
Organization Name
Advanced Semiconductor Engineering, Inc.
Inventor(s)
Hai-Ming Chen of Kaohsiung (TW)
Cheng-Yuan Kung of Kaohsiung (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18119270 titled 'PACKAGE STRUCTURE
The abstract of the patent application describes a package structure that includes a semiconductor substrate with a high-speed signal transmission region and a power transmission region.
- The semiconductor substrate has a lower portion and an upper portion.
- The upper portion defines a high-speed signal transmission region with a first region for communication with a first electronic component and a second region for communication with an external device.
- The lower portion defines a power transmission region.
Potential Applications: - This technology could be used in electronic devices that require high-speed signal transmission and power transmission capabilities. - It could be applied in telecommunications equipment, data centers, and other high-performance electronic systems.
Problems Solved: - The package structure addresses the need for efficient signal transmission and power distribution within electronic devices. - It provides a compact and integrated solution for managing high-speed signals and power requirements.
Benefits: - Improved signal integrity and reduced power losses in electronic systems. - Enhanced reliability and performance of high-speed communication devices.
Commercial Applications: - The technology could be valuable in the development of high-speed data transmission equipment, networking devices, and advanced computing systems. - It may have significant market implications in industries that rely on fast and reliable electronic communication.
Questions about the Technology: 1. How does the package structure optimize signal transmission and power distribution in electronic devices? 2. What are the key advantages of using this semiconductor substrate in high-speed communication systems?
Frequently Updated Research: - Stay updated on advancements in semiconductor packaging technologies and their impact on high-speed signal transmission and power management in electronic devices.
Original Abstract Submitted
A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first electronic component and a second region configured to communicate with an external device. The lower portion of the semiconductor substrate defines a power transmission region
