18180588. SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Winbond Electronics Corp.)
Contents
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Tzu-Hsun Huang of Chiayi City (TW)
Yi-Hao Chien of Taichung City (TW)
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18180588 titled 'SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
The semiconductor structure described in the patent application includes a substrate with buried word lines, a dielectric material layer, a semiconductor material layer, and contacts on the substrate. The contacts are positioned in active regions of the substrate and penetrate multiple layers.
- The semiconductor structure features buried word lines in the substrate.
- The contacts are adjacent to the semiconductor material layer and penetrate multiple layers.
- The substrate includes active regions and isolation structures surrounding them.
- The contacts are positioned in the respective active regions.
- The innovation involves the integration of multiple layers and buried word lines in a semiconductor structure.
Potential Applications: - This technology could be used in the development of advanced semiconductor devices. - It may find applications in the manufacturing of high-performance electronic components.
Problems Solved: - The technology addresses the need for improved integration and performance in semiconductor structures. - It provides a solution for enhancing the functionality of electronic devices.
Benefits: - Improved performance and efficiency in semiconductor devices. - Enhanced integration capabilities for complex electronic components.
Commercial Applications: Title: Advanced Semiconductor Structure for Enhanced Performance This technology could be utilized in the production of high-speed processors, memory chips, and other electronic devices requiring advanced semiconductor structures. The market implications include increased efficiency and performance in electronic products.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching semiconductor structures, buried word lines, and multi-layer integration in electronic devices.
Frequently Updated Research: Stay informed about the latest advancements in semiconductor technology, multi-layer integration, and electronic device manufacturing processes to understand the evolving landscape of this field.
Questions about Semiconductor Structures: 1. What are the key advantages of integrating buried word lines in semiconductor structures? - The integration of buried word lines can enhance the performance and efficiency of semiconductor devices by improving signal transmission and reducing interference.
2. How does the placement of contacts in active regions impact the functionality of the semiconductor structure? - By positioning contacts in active regions, the technology enables efficient communication between different layers of the semiconductor structure, leading to enhanced overall performance.
Original Abstract Submitted
A semiconductor structure includes a substrate, several buried word lines in the substrate, a dielectric material layer on the substrate, a semiconductor material layer on the dielectric material layer, and several contacts disposed on the substrate. The substrate includes several active regions and isolation structures that surround the active regions. The contacts are adjacent to the semiconductor material layer, and penetrate the semiconductor material layer, the dielectric material layer and parts of the substrate. The contacts are positioned in the respective active regions.
