Microsoft technology licensing, llc (20240314917). Circuit Board Cooling Configurations simplified abstract

Circuit Board Cooling Configurations

Organization Name

microsoft technology licensing, llc

Inventor(s)

Ruslan Nagimov of Redmond WA (US)

Circuit Board Cooling Configurations - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240314917 titled 'Circuit Board Cooling Configurations

The abstract discusses thermal management in a circuit board with concentric zones, including a cryogenically cooled chip in the inner zone and non-cryogenic components in the outer zone. The intermediate zone slows thermal energy movement between the outer and inner zones.

• The circuit board includes inner, intermediate, and outer concentric zones.
• A cryogenically cooled chip is located in the inner zone.
• Non-cryogenic electronic components are positioned in the outer zone.
• The intermediate zone has a skeletonized configuration to slow thermal energy movement.
• This design helps manage the heat generated by the components effectively.

Potential Applications: - High-performance computing systems - Aerospace and defense electronics - Automotive electronic control units

Problems Solved: - Efficient thermal management in electronic devices - Prevention of overheating and component failure

Benefits: - Improved reliability and longevity of electronic components - Enhanced performance of high-power systems

Commercial Applications: Title: "Advanced Thermal Management Solutions for High-Performance Electronics" This technology can be utilized in data centers, telecommunications infrastructure, and industrial automation systems to enhance performance and reliability.

Questions about Thermal Management Solutions: 1. How does the skeletonized configuration in the intermediate zone help in thermal management?

  - The skeletonized configuration slows down the transfer of thermal energy between the outer and inner zones, preventing overheating of the components.

2. What are the potential drawbacks of cryogenically cooling a chip in terms of practical implementation?

  - Cryogenic cooling may require specialized equipment and maintenance, adding complexity and cost to the system.

Original Abstract Submitted

the discussion relates to thermal management. one example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. in this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.