Tokyo electron limited (20240295024). SUBSTRATE PROCESSING APPARATUS simplified abstract
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Makoto Takahashi of Iwate (JP)
Tatsuya Yamaguchi of Tokyo (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240295024 titled 'SUBSTRATE PROCESSING APPARATUS
The abstract describes a substrate processing apparatus with a gas supply chamber and an injector for supplying gas to the processing container.
- Simplified Explanation:
- The apparatus can hold a substrate holder for substrates. - It has a gas supply chamber in the side wall. - A supply-side pipe extends horizontally from the gas supply chamber. - An injector is detachably disposed spanning through the gas supply chamber and the supply-side pipe.
- Key Features and Innovation:
- Gas supply chamber in the side wall of the processing container. - Horizontal supply-side pipe for gas delivery. - Detachable injector for gas supply.
- Potential Applications:
- Semiconductor manufacturing. - Thin film deposition processes. - Solar panel production.
- Problems Solved:
- Efficient gas supply to the processing container. - Enhanced substrate processing capabilities.
- Benefits:
- Improved substrate processing efficiency. - Precise gas delivery control. - Increased production yield.
- Commercial Applications:
- Title: Gas Supply System for Substrate Processing Apparatus. - Potential use in semiconductor industry. - Market implications in electronics manufacturing.
- Questions about Gas Supply Systems:
1. How does the gas supply chamber enhance substrate processing efficiency? - The gas supply chamber allows for precise control and delivery of gas to the processing container, optimizing the substrate processing conditions.
2. What are the advantages of using a horizontal supply-side pipe in the apparatus? - The horizontal supply-side pipe ensures uniform gas distribution across the substrate surface, improving processing quality.
Original Abstract Submitted
a substrate processing apparatus includes: a processing container capable of accommodating a substrate holder that holds substrates; a gas supply chamber provided in a side wall of the processing container, a supply-side pipe extending horizontally from the gas supply chamber, and an injector detachably disposed spanning through the gas supply chamber and the supply-side pipe.
