International business machines corporation (20240290730). DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING simplified abstract
Contents
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
Organization Name
international business machines corporation
Inventor(s)
Sathyanarayanan Raghavan of Ballston Lake NY (US)
Mukta Ghate Farooq of HOPEWELL JCT NY (US)
Prabudhya Roy Chowdhury of Albany NY (US)
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290730 titled 'DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
The semiconductor structure described in the patent application is designed to tailor the stiffness of a die by incorporating grooves on the backside of the semiconductor die.
- The semiconductor structure includes a packaging substrate, a lid, and a first semiconductor die with semiconductor devices on the frontside.
- The backside of the first semiconductor die features grooves that are less than the thickness of the die, allowing for flexibility and tailored stiffness.
- This innovative design allows for customization of the die stiffness, which can be beneficial in various applications where specific mechanical properties are required.
- By adjusting the grooves on the backside of the semiconductor die, the overall stiffness of the die can be modified to suit different needs.
- This technology offers a unique approach to optimizing the mechanical properties of semiconductor devices, enhancing their performance and versatility.
Potential Applications: - This technology can be applied in the manufacturing of electronic devices where customized stiffness of the semiconductor die is necessary. - It can be used in industries such as automotive, aerospace, and consumer electronics to improve the reliability and performance of electronic components.
Problems Solved: - Provides a solution for tailoring the stiffness of semiconductor dies to meet specific requirements in various applications. - Offers a way to enhance the mechanical properties of semiconductor devices without compromising their functionality.
Benefits: - Customizable stiffness of semiconductor dies for improved performance. - Enhanced reliability and durability of electronic components. - Greater flexibility in design and manufacturing processes.
Commercial Applications: Title: Customizable Semiconductor Die Stiffness for Enhanced Performance This technology can be utilized in the production of advanced electronic devices across industries such as automotive, aerospace, and consumer electronics. The ability to tailor the stiffness of semiconductor dies can lead to more reliable and efficient products, offering a competitive edge in the market.
Questions about the technology: 1. How does the presence of grooves on the backside of the semiconductor die impact its overall stiffness? 2. What are the potential implications of customizing the stiffness of semiconductor dies in various industries?
Original Abstract Submitted
a semiconductor structure for tailoring a die stiffness. the semiconductor structure may include a packaging substrate, a lid, and a first semiconductor die between the packaging substrate and the lid. the first semiconductor die may have a frontside attached to the packaging substrate that has semiconductor devices. the first semiconductor die may also have a backside, opposite the frontside, that has grooves less than a thickness of the first semiconductor die.
