Seiko epson corporation (20240286411). Liquid Ejecting Head And Liquid Ejecting Apparatus simplified abstract

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Liquid Ejecting Head And Liquid Ejecting Apparatus

Organization Name

seiko epson corporation

Inventor(s)

Haruki Kobayashi of Matsumoto (JP)

Shun Katsuie of Matsumoto (JP)

Liquid Ejecting Head And Liquid Ejecting Apparatus - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240286411 titled 'Liquid Ejecting Head And Liquid Ejecting Apparatus

The liquid ejecting head described in the patent application includes a flow path structure with various communication paths for liquid flow.

  • The first head chip has nozzles that communicate with the flow paths for liquid ejection.
  • A joint member is detachably fixed to the flow path structure, connecting the different flow paths together.
  • An adhesive is used to ensure liquid-tight communication between the flow paths via the joint member.

Potential Applications: - This technology can be used in inkjet printers for precise and efficient liquid ejection. - It can also be applied in 3D printing for accurate material deposition.

Problems Solved: - Ensures proper communication between different flow paths for consistent liquid ejection. - Allows for easy maintenance and replacement of components.

Benefits: - Improved printing quality and efficiency. - Reduced chances of clogging or misalignment in the liquid ejecting system.

Commercial Applications: - This technology can be valuable for printer manufacturers looking to enhance the performance of their products. - It can also benefit companies involved in additive manufacturing processes.

Questions about the technology: 1. How does the detachable joint member improve the functionality of the liquid ejecting head? 2. What specific advantages does the adhesive provide in maintaining liquid-tight communication between the flow paths?


Original Abstract Submitted

a liquid ejecting head includes a flow path structure having a first coupling flow path, a first head chip having a second coupling flow path that communicates with first nozzles, and a first joint member having a first relay flow path that communicates with the first coupling flow path and the second coupling flow path, in which the first joint member is detachably fixed to the flow path structure so that the first coupling flow path and the first relay flow path are coupled to each other, and the second coupling flow path and the first relay flow path liquid-tightly communicate with each other via an adhesive disposed around an opening of the first relay flow path facing the second coupling flow path.