18154440. ELECTRONIC DEVICE AND SPEAKER STRUCTURE INCLUDED IN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
ELECTRONIC DEVICE AND SPEAKER STRUCTURE INCLUDED IN ELECTRONIC DEVICE
Organization Name
Inventor(s)
Changshik Yoon of Suwon-si (KR)
Byounghee Lee of Suwon-si (KR)
Myeungseon Kim of Suwon-si (KR)
ELECTRONIC DEVICE AND SPEAKER STRUCTURE INCLUDED IN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18154440 titled 'ELECTRONIC DEVICE AND SPEAKER STRUCTURE INCLUDED IN ELECTRONIC DEVICE
Simplified Explanation
The abstract describes a speaker structure that includes a speaker housing, a diaphragm with a voice coil, a cover plate, a yoke, pads, and a connection member. The connection member connects the pads and is placed on the yoke.
- The speaker structure includes a speaker housing that holds a diaphragm with a voice coil.
- A cover plate is placed on the front surface of the speaker housing.
- A yoke is placed on the back surface of the speaker housing.
- Two pads are electrically connected to the voice coil and placed on the back surface of the speaker housing.
- A connection member is electrically connected to the pads and is positioned on the yoke.
Potential applications of this technology:
- Audio systems in various devices such as smartphones, tablets, laptops, and televisions.
- Automotive sound systems.
- Public address systems in stadiums, theaters, and concert halls.
Problems solved by this technology:
- Provides a compact and efficient speaker structure.
- Ensures proper electrical connection between the voice coil and the pads.
- Helps in improving the overall sound quality and performance of the speaker.
Benefits of this technology:
- Compact design allows for integration into smaller devices.
- Efficient speaker structure enhances sound reproduction.
- Reliable electrical connection ensures consistent performance.
- Improved sound quality enhances the user experience.
Original Abstract Submitted
A speaker structure according to various embodiments disclosed in the present document may comprise: a speaker housing which receives a diaphragm to which a voice coil is fixed and the speaker housing has a first surface and a second surface opposite to the first surface; a cover plate disposed on the first surface of the speaker housing; a yoke disposed on the second surface of the speaker housing; first and second pads disposed on the second surface of the speaker housing and electrically connected to the voice coil; and a connection member electrically connected to the first pad and the second pad, wherein the connection member may have a portion connecting the first pad and the second pad, and may be disposed on the yoke. Various other embodiments are also possible.
