SEMICONDUCTOR DEVICE

Organization Name

Inventor(s)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18649331 titled 'SEMICONDUCTOR DEVICE

The semiconductor device described in the abstract includes a semiconductor element, a lead, and a sealing resin. The lead consists of a die pad and terminal, with the die pad having a lead obverse surface for mounting the semiconductor element and a lead reverse surface.

The lead reverse surface is exposed from the sealing resin and located on the first side in a first direction.
The sealing resin covers the semiconductor element and part of the die pad.
The sealing resin has a first resin surface facing the first side, a second resin surface facing the second side, and a third resin surface facing a first side in a first direction orthogonal to the thickness direction.

Potential Applications: - This technology can be used in various semiconductor devices for improved performance and reliability. - It can be applied in electronic components where sealing and protection of the semiconductor element are crucial.

Problems Solved: - Provides enhanced protection for the semiconductor element and lead connections. - Ensures better durability and longevity of the semiconductor device.

Benefits: - Improved reliability and performance of semiconductor devices. - Enhanced protection against environmental factors and mechanical stress.

Commercial Applications: - This technology can be utilized in the manufacturing of various electronic devices such as smartphones, computers, and automotive components.

Questions about the technology: 1. How does the sealing resin contribute to the overall durability of the semiconductor device? 2. What are the specific advantages of having a lead reverse surface exposed from the sealing resin?

Frequently Updated Research: - Stay updated on advancements in semiconductor packaging and sealing technologies to enhance the performance and reliability of electronic devices.

Original Abstract Submitted

A semiconductor device includes a semiconductor element, a lead and a sealing resin. The lead includes a die pad and terminal. The die pad includes a lead obverse surface facing a first side in a thickness direction for mounting the semiconductor element, and a lead reverse surface facing a second side in the thickness direction. The sealing resin includes a first resin surface facing the first side in the thickness direction, a second resin surface facing the second side in the thickness direction, and a third resin surface facing a first side in a first direction orthogonal to the thickness direction. The sealing covers resin the semiconductor element and a part of the die pad. The lead reverse surface includes a portion exposed from the second resin surface and located on the first side in the first direction from the third resin surface as viewed in the thickness direction.