PHOTONICS INTEGRATED CIRCUIT PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

PHOTONICS INTEGRATED CIRCUIT PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18440297 titled 'PHOTONICS INTEGRATED CIRCUIT PACKAGE

The abstract describes an integrated circuit package that combines a photonic die (oDie) and an electronic die (eDie) within a molded material surrounded by redistribution layers.

The integrated circuit package includes multiple redistribution layers that are connected to either the oDie or the eDie.
The molded material partially encloses the oDie and/or the eDie within the package.

Potential Applications:

This technology could be used in telecommunications, data centers, and other high-speed computing applications.
It may also find applications in sensors, medical devices, and aerospace technology.

Problems Solved:

Integrating photonic and electronic components in a single package can reduce the size and complexity of systems.
This technology can improve the efficiency and performance of integrated circuits.

Benefits:

Enhanced speed and bandwidth capabilities.
Reduced power consumption and heat generation.
Compact and versatile design for various applications.

Commercial Applications:

This technology could be valuable for companies developing advanced communication systems, high-performance computing devices, and cutting-edge sensor technologies.

Questions about the integrated circuit package: 1. How does the integration of photonic and electronic dies benefit the overall performance of the package? 2. What are the potential challenges in manufacturing and implementing this technology on a large scale?

Frequently Updated Research:

Ongoing research in materials science, photonics, and electronics could further enhance the capabilities and applications of this integrated circuit package.

Original Abstract Submitted

An integrated circuit package integrates a photonic die (oDie) and an electronic die (eDie). More specifically, the integrated circuit package may include a plurality of redistribution layers communicatively coupled to at least one of the oDie and/or the eDie, where molded material at least partially surrounds the at least one of the oDie and/or the eDie.