18591755. METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE simplified abstract (Infineon Technologies Austria AG)

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE

Organization Name

Infineon Technologies Austria AG

Inventor(s)

Edward Fuergut of Dasing (DE)

Achim Althaus of Regensburg (DE)

Martin Gruber of Schwandorf (DE)

Marco Nicolas Mueller of Villach (AT)

Bernd Schmoelzer of Radenthein (AT)

Wolfgang Scholz of Olching (DE)

Mark Thomas of Bodensdorf (AT)

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18591755 titled 'METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE

The method described in the abstract involves fabricating a semiconductor device by providing a die carrier, placing a semiconductor die with contact pads on the carrier, applying an encapsulant and an insulation layer, and creating electrical interconnects.

• Die carrier provided
• Semiconductor die with contact pads placed on carrier
• Encapsulant applied to die and carrier
• Insulation layer applied over encapsulant
• Electrical interconnects fabricated by forming openings and filling with conductive material

Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuit production

Problems Solved: - Efficient fabrication of semiconductor devices - Improved electrical interconnects - Enhanced reliability of devices

Benefits: - Streamlined manufacturing process - Enhanced device performance - Increased reliability and durability

Commercial Applications: Title: Semiconductor Device Fabrication Method for Enhanced Performance This technology can be used in the production of various semiconductor devices, such as microprocessors, memory chips, and sensors, to improve performance and reliability. The streamlined fabrication process can lead to cost savings and increased competitiveness in the electronics market.

Questions about Semiconductor Device Fabrication Method: 1. How does the method described in the patent application improve the reliability of semiconductor devices? - The method ensures proper encapsulation and insulation, reducing the risk of electrical failures and enhancing device durability.

2. What are the key advantages of using a die carrier in semiconductor device fabrication? - The die carrier provides a stable platform for placing the semiconductor die and facilitates the encapsulation process, leading to consistent device quality.

Original Abstract Submitted

A method for fabricating a semiconductor device includes: providing a die carrier; disposing a semiconductor die on a main face of the die carrier, the semiconductor die having one or more contact pads; applying an encapsulant at least partially to the semiconductor die and at least a portion of the main face of the die carrier; applying an insulation layer to the encapsulant; and fabricating electrical interconnects by forming openings into the encapsulant and the insulation layer and filling a conductive material into the openings. Additional methods for fabricating a semiconductor device are described.