18416484. WIRELESS MODULE simplified abstract (Fujikura Ltd.)
Contents
WIRELESS MODULE
Organization Name
Inventor(s)
Noriaki Shigematsu of Sakura-shi (JP)
Kiyoshi Kobayashi of Sakura-shi (JP)
WIRELESS MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18416484 titled 'WIRELESS MODULE
Simplified Explanation:
The wireless module described in the patent application includes a substrate with an antenna for high-frequency signals in the millimeter-wave band, a high-temperature element supplying signals to the antenna, and a housing with a cover and case enclosing the substrate.
Key Features and Innovation:
- The wireless module operates in the millimeter-wave band for high-frequency signals.
- The high-temperature element on the substrate supplies signals to the antenna.
- The housing includes a cover and case that enclose the substrate.
- A heat dissipation part in the case helps manage heat from the high-temperature element.
- A heat dissipation sheet between the heat dissipation part and the high-temperature element aids in heat management.
- The cover and heat dissipation part compress the heat dissipation sheet and substrate for efficient heat dissipation.
Potential Applications: The wireless module can be used in various communication devices, IoT applications, and wireless networks that require high-frequency signal transmission and reception in the millimeter-wave band.
Problems Solved: This technology addresses the challenge of managing heat generated by high-temperature elements in wireless modules, ensuring efficient operation and longevity of the device.
Benefits:
- Improved heat dissipation for high-temperature elements.
- Enhanced performance and reliability of wireless communication devices.
- Longer lifespan of wireless modules due to effective heat management.
Commercial Applications: Potential commercial applications include 5G communication devices, IoT sensors, wireless routers, and other high-frequency wireless communication systems. The technology can benefit telecommunications companies, IoT manufacturers, and network infrastructure providers.
Questions about Wireless Module Technology: 1. How does the housing design contribute to efficient heat dissipation in the wireless module? 2. What are the specific advantages of operating in the millimeter-wave band for high-frequency signals in wireless communication devices?
Original Abstract Submitted
A wireless module includes: a first substrate including an antenna that transmits and receives high-frequency signals in a millimeter-wave band, a first high-temperature element that supplies high-frequency signals to the antenna being mounted on the first substrate; and a housing including a cover and a case combined with each other and housing the first substrate, the first substrate is in contact with the cover in an opposing direction in which the case and the cover oppose each other, the case includes a first heat dissipation part protruding toward the first high-temperature element, a first heat dissipation sheet is provided between the first heat dissipation part and the first high-temperature element in the opposing direction, and the cover and the first heat dissipation part compress the first heat dissipation sheet and the first substrate in the opposing direction.
